Issued Patents All Time
Showing 51–75 of 149 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11594801 | Mmwave dielectric waveguide interconnect topology for automotive applications | Sasha N. Oster, Telesphor Kamgaing, Erich N. Ewy, Kenneth D. Shoemaker, Adel A. Elsherbini +1 more | 2023-02-28 |
| 11581272 | Contactless high-frequency interconnect | Henning Braunisch, Adel A. Elsherbini, Telesphor Kamgaing, Richard J. Dischler, Johanna M. Swan +1 more | 2023-02-14 |
| 11575749 | Low-weight single mm-wave dielectric waveguide interconnect architecture in autonomous cars | Sasha N. Oster, Adel A. Elsherbini, Erich N. Ewy, Johanna M. Swan, Telesphor Kamgaing | 2023-02-07 |
| 11538758 | Waveguide interconnect bridges | Johanna M. Swan | 2022-12-27 |
| 11532574 | Through-substrate waveguide | Aleksandar Aleksov, Telesphor Kamgaing, Gilbert Dewey, Hyung-Jin Lee | 2022-12-20 |
| 11476554 | Mmwave waveguide to waveguide connectors for automotive applications | Sasha N. Oster, Telesphor Kamgaing, Erich N. Ewy, Adel A. Elsherbini, Johanna M. Swan | 2022-10-18 |
| 11462810 | Multiplexer and combiner structures embedded in a mmwave connector interface | Telesphor Kamgaing, Sasha N. Oster, Johanna M. Swan | 2022-10-04 |
| 11456721 | RF front end module including hybrid filter and active circuits in a single package | Feras Eid, Telesphor Kamgaing, Vijay K. Nair, Johanna M. Swan | 2022-09-27 |
| 11437693 | Mmwave waveguides featuring power-over-waveguide technology for automotive applications | Sasha N. Oster, Telesphor Kamgaing, Kenneth D. Shoemaker, Erich N. Ewy, Adel A. Elsherbini +1 more | 2022-09-06 |
| 11437706 | Package with side-radiating wave launcher and waveguide | Aleksandar Aleksov, Telesphor Kamgaing, Gilbert Dewey, Hyung-Jin Lee | 2022-09-06 |
| 11430751 | Microelectronic devices designed with 3D stacked ultra thin package modules for high frequency communications | Aleksandar Aleksov, Telesphor Kamgaing, Sasha N. Oster | 2022-08-30 |
| 11394094 | Waveguide connector having a curved array of waveguides configured to connect a package to excitation elements | Telesphor Kamgaing, Sasha N. Oster, Adel A. Elsherbini, Shawna M. Liff, Aleksandar Aleksov +2 more | 2022-07-19 |
| 11387200 | Microelectronic devices with high frequency communication modules having compound semiconductor devices integrated on a package fabric | Telesphor Kamgaing, Javier A. Falcon, Yoshihiro Tomita, Vijay K. Nair | 2022-07-12 |
| 11380624 | Electromagnetic interference shield created on package using high throughput additive manufacturing | Feras Eid, Henning Braunisch, Shawna M. Liff, Johanna M. Swan | 2022-07-05 |
| 11367937 | Waveguides with active or passive repeaters for range extension | Sasha N. Oster, Telesphor Kamgaing | 2022-06-21 |
| 11367708 | Microelectronic devices designed with efficient partitioning of high frequency communication devices integrated on a package fabric | Vijay K. Nair, Telesphor Kamgaing | 2022-06-21 |
| 11335651 | Microelectronic devices designed with compound semiconductor devices and integrated on an inter die fabric | Telesphor Kamgaing, Vijay K. Nair, Javier A. Falcon, Shawna M. Liff, Yoshihiro Tomita | 2022-05-17 |
| 11328986 | Capacitor-wirebond pad structures for integrated circuit packages | Aleksandar Aleksov, Feras Eid, Telesphor Kamgaing, Johanna M. Swan | 2022-05-10 |
| 11329359 | Dielectric waveguide including a dielectric material with cavities therein surrounded by a conductive coating forming a wall for the cavities | Adel A. Elsherbini, Telesphor Kamgaing, Henning Braunisch, Johanna M. Swan | 2022-05-10 |
| 11316497 | Multi-filter die | Aleksandar Aleksov, Feras Eid, Telesphor Kamgaing, Johanna M. Swan | 2022-04-26 |
| 11310907 | Microelectronic package with substrate-integrated components | Aleksandar Aleksov, Feras Eid, Telesphor Kamgaing, Johanna M. Swan | 2022-04-19 |
| 11309619 | Waveguide coupling systems and methods | Sasha N. Oster, Telesphor Kamgaing, Adel A. Elsherbini, Shawna M. Liff, Aleksandar Aleksov +1 more | 2022-04-19 |
| 11282800 | Substrate integrated inductors using high throughput additive deposition of hybrid magnetic materials | Henning Braunisch, Feras Eid | 2022-03-22 |
| 11283427 | Hybrid filters and packages therefor | Telesphor Kamgaing, Feras Eid, Vijay K. Nair, Johanna M. Swan | 2022-03-22 |
| 11264687 | Microelectronic assemblies comprising a package substrate portion integrated with a substrate integrated waveguide filter | Adel A. Elsherbini | 2022-03-01 |