Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11955434 | Ultra small molded module integrated with die by module-on-wafer assembly | Yoshihiro Tomita, Eric J. Li, Shawna M. Liff, Joshua D. Heppner | 2024-04-09 |
| 11881457 | Semiconductor packaging with high density interconnects | Adel A. Elsherbini, Johanna M. Swan, Shawna M. Liff, Henning Braunisch, Krishna Bharath +1 more | 2024-01-23 |
| 11387200 | Microelectronic devices with high frequency communication modules having compound semiconductor devices integrated on a package fabric | Georgios Dogiamis, Telesphor Kamgaing, Yoshihiro Tomita, Vijay K. Nair | 2022-07-12 |
| 11335651 | Microelectronic devices designed with compound semiconductor devices and integrated on an inter die fabric | Telesphor Kamgaing, Georgios Dogiamis, Vijay K. Nair, Shawna M. Liff, Yoshihiro Tomita | 2022-05-17 |
| 11296052 | TSV-less die stacking using plated pillars/through mold interconnect | Preston T. Meyers, Shawna M. Liff, Joe Saucedo, Adel A. Elsherbini, Albert S. Lopez +1 more | 2022-04-05 |
| 11177912 | Quantum circuit assemblies with on-chip demultiplexers | Adel A. Elsherbini, Lester Lampert | 2021-11-16 |
| 10971453 | Semiconductor packaging with high density interconnects | Adel A. Elsherbini, Johanna M. Swan, Shawna M. Liff, Henning Braunisch, Krishna Bharath +1 more | 2021-04-06 |
| 10756004 | Quantum computing assemblies with through-hole dies | Adel A. Elsherbini, David J. Michalak | 2020-08-25 |
| 10707171 | Ultra small molded module integrated with die by module-on-wafer assembly | Tomita YOSHIHIRO, Eric J. Li, Shawna M. Liff, Joshua D. Heppner | 2020-07-07 |
| 10629551 | Microelectronic devices with high frequency communication modules having compound semiconductor devices integrated on a package fabric | Georgios Dogiamis, Telesphor Kamgaing, Yoshihiro Tomita, Vijay K. Nair | 2020-04-21 |
| 10573608 | Microelectronic devices designed with high frequency communication devices including compound semiconductor devices integrated on a die fabric on package | Georgios Dogiamis, Telesphor Kamgaing, Eric J. Li, Yoshihiro Tomita, Vijay K. Nair +1 more | 2020-02-25 |
| 10468578 | Package substrates with top superconductor layers for qubit devices | Adel A. Elsherbini, Roman Caudillo, James S. Clarke | 2019-11-05 |
| 10380496 | Quantum computing assemblies | Adel A. Elsherbini, Hubert C. George, Shawna M. Liff, James S. Clarke | 2019-08-13 |
| 10319896 | Shielded interconnects | Adel A. Elsherbini, Johanna M. Swan, Shawna M. Liff, Ye Seul Nam, James S. Clarke +2 more | 2019-06-11 |
| 10256206 | Qubit die attachment using preforms | Ye Seul Nam, Adel A. Elsherbini, Roman Caudillo, James S. Clarke | 2019-04-09 |
| 9728425 | Space-efficient underfilling techniques for electronic assemblies | Joshua D. Heppner, Serge Louis Roux, Michael J. Baker | 2017-08-08 |