| 11955434 |
Ultra small molded module integrated with die by module-on-wafer assembly |
Yoshihiro Tomita, Eric J. Li, Shawna M. Liff, Joshua D. Heppner |
2024-04-09 |
$27,197,000 |
| 11881457 |
Semiconductor packaging with high density interconnects |
Adel A. Elsherbini, Johanna M. Swan, Shawna M. Liff, Henning Braunisch, Krishna Bharath +1 more |
2024-01-23 |
|
| 11387200 |
Microelectronic devices with high frequency communication modules having compound semiconductor devices integrated on a package fabric |
Georgios Dogiamis, Telesphor Kamgaing, Yoshihiro Tomita, Vijay K. Nair |
2022-07-12 |
$13,106,000 |
| 11335651 |
Microelectronic devices designed with compound semiconductor devices and integrated on an inter die fabric |
Telesphor Kamgaing, Georgios Dogiamis, Vijay K. Nair, Shawna M. Liff, Yoshihiro Tomita |
2022-05-17 |
$14,251,000 |
| 11296052 |
TSV-less die stacking using plated pillars/through mold interconnect |
Preston T. Meyers, Shawna M. Liff, Joe Saucedo, Adel A. Elsherbini, Albert S. Lopez +1 more |
2022-04-05 |
$18,322,000 |
| 11177912 |
Quantum circuit assemblies with on-chip demultiplexers |
Adel A. Elsherbini, Lester Lampert |
2021-11-16 |
$23,453,000 |
| 10971453 |
Semiconductor packaging with high density interconnects |
Adel A. Elsherbini, Johanna M. Swan, Shawna M. Liff, Henning Braunisch, Krishna Bharath +1 more |
2021-04-06 |
$36,336,000 |
| 10756004 |
Quantum computing assemblies with through-hole dies |
Adel A. Elsherbini, David J. Michalak |
2020-08-25 |
$27,661,000 |
| 10707171 |
Ultra small molded module integrated with die by module-on-wafer assembly |
Tomita YOSHIHIRO, Eric J. Li, Shawna M. Liff, Joshua D. Heppner |
2020-07-07 |
$29,601,000 |
| 10629551 |
Microelectronic devices with high frequency communication modules having compound semiconductor devices integrated on a package fabric |
Georgios Dogiamis, Telesphor Kamgaing, Yoshihiro Tomita, Vijay K. Nair |
2020-04-21 |
$45,742,000 |
| 10573608 |
Microelectronic devices designed with high frequency communication devices including compound semiconductor devices integrated on a die fabric on package |
Georgios Dogiamis, Telesphor Kamgaing, Eric J. Li, Yoshihiro Tomita, Vijay K. Nair +1 more |
2020-02-25 |
$18,813,000 |
| 10468578 |
Package substrates with top superconductor layers for qubit devices |
Adel A. Elsherbini, Roman Caudillo, James S. Clarke |
2019-11-05 |
$22,190,000 |
| 10380496 |
Quantum computing assemblies |
Adel A. Elsherbini, Hubert C. George, Shawna M. Liff, James S. Clarke |
2019-08-13 |
$24,877,000 |
| 10319896 |
Shielded interconnects |
Adel A. Elsherbini, Johanna M. Swan, Shawna M. Liff, Ye Seul Nam, James S. Clarke +2 more |
2019-06-11 |
$16,707,000 |
| 10256206 |
Qubit die attachment using preforms |
Ye Seul Nam, Adel A. Elsherbini, Roman Caudillo, James S. Clarke |
2019-04-09 |
$21,845,000 |
| 9728425 |
Space-efficient underfilling techniques for electronic assemblies |
Joshua D. Heppner, Serge Louis Roux, Michael J. Baker |
2017-08-08 |
$11,912,000 |
