Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10707171 | Ultra small molded module integrated with die by module-on-wafer assembly | Eric J. Li, Shawna M. Liff, Javier A. Falcon, Joshua D. Heppner | 2020-07-07 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10707171 | Ultra small molded module integrated with die by module-on-wafer assembly | Eric J. Li, Shawna M. Liff, Javier A. Falcon, Joshua D. Heppner | 2020-07-07 |