Issued Patents All Time
Showing 25 most recent of 51 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11955434 | Ultra small molded module integrated with die by module-on-wafer assembly | Yoshihiro Tomita, Shawna M. Liff, Javier A. Falcon, Joshua D. Heppner | 2024-04-09 |
| 11903138 | Fine feature formation techniques for printed circuit boards | Kemal Aygun, Kai Xiao, Gong Ouyang, Zhichao Zhang | 2024-02-13 |
| 11705377 | Stacked die cavity package | Mitul Modi, Robert L. Sankman, Debendra Mallik, Ravindranath V. Mahajan, Amruthavalli Pallavi Alur +1 more | 2023-07-18 |
| 11676900 | Electronic assembly that includes a bridge | Nitin A. Deshpande, Shawna M. Liff, Omkar G. Karhade, Amram Eitan, Timothy A. Gosselin | 2023-06-13 |
| 11545441 | Semiconductor package having wafer-level active die and external die mount | Vipul V. Mehta, Sanka Ganesan, Debendra Mallik, Robert L. Sankman | 2023-01-03 |
| 11328968 | Stacked die cavity package | Mitul Modi, Robert L. Sankman, Debendra Mallik, Ravindranath V. Mahajan, Amruthavalli Pallavi Alur +1 more | 2022-05-10 |
| 11114388 | Warpage control for microelectronics packages | Guotao Wang, Huiyang Fei, Sairam Agraharam, Omkar G. Karhade, Nitin A. Deshpande | 2021-09-07 |
| 11089689 | Fine feature formation techniques for printed circuit boards | Kemal Aygun, Kai Xiao, Gong Ouyang, Zhichao Zhang | 2021-08-10 |
| 11075166 | Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate | Timothy A. Gosselin, Yoshihiro Tomita, Shawna M. Liff, Amram Eitan, Mark Saltas | 2021-07-27 |
| 10910317 | Semiconductor package having wafer-level active die and external die mount | Vipul V. Mehta, Sanka Ganesan, Debendra Mallik, Robert L. Sankman | 2021-02-02 |
| 10790231 | Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate | Timothy A. Gosselin, Yoshihiro Tomita, Shawna M. Liff, Amram Eitan, Mark Saltas | 2020-09-29 |
| 10707171 | Ultra small molded module integrated with die by module-on-wafer assembly | Tomita YOSHIHIRO, Shawna M. Liff, Javier A. Falcon, Joshua D. Heppner | 2020-07-07 |
| 10672626 | Method and materials for warpage thermal and interconnect solutions | Omkar G. Karhade, Nitin A. Deshpande, Aditya Sundoctor VAIDYA, Nachiket R. Raravikar | 2020-06-02 |
| 10615128 | Systems and methods for electromagnetic interference shielding | Rajendra C. Dias, Anna M. Prakash, Joshua D. Heppner, Nachiket R. Raravikar | 2020-04-07 |
| 10573608 | Microelectronic devices designed with high frequency communication devices including compound semiconductor devices integrated on a die fabric on package | Georgios Dogiamis, Telesphor Kamgaing, Javier A. Falcon, Yoshihiro Tomita, Vijay K. Nair +1 more | 2020-02-25 |
| 10541190 | Stacked die package with through-mold thermally conductive structures between a bottom die and a thermally conductive material | Chandra Mohan Jha | 2020-01-21 |
| 10504863 | Variable ball height on ball grid array packages by solder paste transfer | Jimin Yao, Shawna M. Liff | 2019-12-10 |
| 10418329 | Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate | Timothy A. Gosselin, Yoshihiro Tomita, Shawna M. Liff, Amram Eitan, Mark Saltas | 2019-09-17 |
| 10373888 | Electronic package assembly with compact die placement | Vipul V. Mehta, Digvijay A. Raorane | 2019-08-06 |
| 10325866 | Electronic device packages with conformal EMI shielding and related methods | Joshua D. Heppner, Rajendra C. Dias, Mitul Modi | 2019-06-18 |
| 10256198 | Warpage control for microelectronics packages | Guotao Wang, Huiyang Fei, Sairam Agraharam, Omkar G. Karhade, Nitin A. Deshpande | 2019-04-09 |
| 10256205 | Variable ball height on ball grid array packages by solder paste transfer | Jimin Yao, Shawna M. Liff | 2019-04-09 |
| 10249515 | Electronic device package | Jimin Yao, Shawna M. Liff | 2019-04-02 |
| 10224290 | Electromagnetically shielded electronic devices and related systems and methods | Rajendra C. Dias, Takashi Kumamoto, Yoshishiro Tomita, Mitul Modi, Joshua D. Heppner | 2019-03-05 |
| 10224223 | Low temperature thin wafer backside vacuum process with backgrinding tape | — | 2019-03-05 |