| 11955434 |
Ultra small molded module integrated with die by module-on-wafer assembly |
Yoshihiro Tomita, Shawna M. Liff, Javier A. Falcon, Joshua D. Heppner |
2024-04-09 |
$27,197,000 |
| 11903138 |
Fine feature formation techniques for printed circuit boards |
Kemal Aygun, Kai Xiao, Gong Ouyang, Zhichao Zhang |
2024-02-13 |
$18,546,000 |
| 11705377 |
Stacked die cavity package |
Mitul Modi, Robert L. Sankman, Debendra Mallik, Ravindranath V. Mahajan, Amruthavalli Pallavi Alur +1 more |
2023-07-18 |
$21,060,000 |
| 11676900 |
Electronic assembly that includes a bridge |
Nitin A. Deshpande, Shawna M. Liff, Omkar G. Karhade, Amram Eitan, Timothy A. Gosselin |
2023-06-13 |
$22,204,000 |
| 11545441 |
Semiconductor package having wafer-level active die and external die mount |
Vipul V. Mehta, Sanka Ganesan, Debendra Mallik, Robert L. Sankman |
2023-01-03 |
$15,575,000 |
| 11328968 |
Stacked die cavity package |
Mitul Modi, Robert L. Sankman, Debendra Mallik, Ravindranath V. Mahajan, Amruthavalli Pallavi Alur +1 more |
2022-05-10 |
$19,182,000 |
| 11114388 |
Warpage control for microelectronics packages |
Guotao Wang, Huiyang Fei, Sairam Agraharam, Omkar G. Karhade, Nitin A. Deshpande |
2021-09-07 |
$31,495,000 |
| 11089689 |
Fine feature formation techniques for printed circuit boards |
Kemal Aygun, Kai Xiao, Gong Ouyang, Zhichao Zhang |
2021-08-10 |
$36,027,000 |
| 11075166 |
Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate |
Timothy A. Gosselin, Yoshihiro Tomita, Shawna M. Liff, Amram Eitan, Mark Saltas |
2021-07-27 |
$27,337,000 |
| 10910317 |
Semiconductor package having wafer-level active die and external die mount |
Vipul V. Mehta, Sanka Ganesan, Debendra Mallik, Robert L. Sankman |
2021-02-02 |
$28,243,000 |
| 10790231 |
Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate |
Timothy A. Gosselin, Yoshihiro Tomita, Shawna M. Liff, Amram Eitan, Mark Saltas |
2020-09-29 |
$31,444,000 |
| 10707171 |
Ultra small molded module integrated with die by module-on-wafer assembly |
Tomita YOSHIHIRO, Shawna M. Liff, Javier A. Falcon, Joshua D. Heppner |
2020-07-07 |
$29,601,000 |
| 10672626 |
Method and materials for warpage thermal and interconnect solutions |
Omkar G. Karhade, Nitin A. Deshpande, Aditya Sundoctor VAIDYA, Nachiket R. Raravikar |
2020-06-02 |
$32,838,000 |
| 10615128 |
Systems and methods for electromagnetic interference shielding |
Rajendra C. Dias, Anna M. Prakash, Joshua D. Heppner, Nachiket R. Raravikar |
2020-04-07 |
$35,530,000 |
| 10573608 |
Microelectronic devices designed with high frequency communication devices including compound semiconductor devices integrated on a die fabric on package |
Georgios Dogiamis, Telesphor Kamgaing, Javier A. Falcon, Yoshihiro Tomita, Vijay K. Nair +1 more |
2020-02-25 |
$18,813,000 |
| 10541190 |
Stacked die package with through-mold thermally conductive structures between a bottom die and a thermally conductive material |
Chandra Mohan Jha |
2020-01-21 |
$31,546,000 |
| 10504863 |
Variable ball height on ball grid array packages by solder paste transfer |
Jimin Yao, Shawna M. Liff |
2019-12-10 |
$22,400,000 |
| 10418329 |
Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate |
Timothy A. Gosselin, Yoshihiro Tomita, Shawna M. Liff, Amram Eitan, Mark Saltas |
2019-09-17 |
$19,673,000 |
| 10373888 |
Electronic package assembly with compact die placement |
Vipul V. Mehta, Digvijay A. Raorane |
2019-08-06 |
$15,127,000 |
| 10325866 |
Electronic device packages with conformal EMI shielding and related methods |
Joshua D. Heppner, Rajendra C. Dias, Mitul Modi |
2019-06-18 |
$21,210,000 |
| 10256198 |
Warpage control for microelectronics packages |
Guotao Wang, Huiyang Fei, Sairam Agraharam, Omkar G. Karhade, Nitin A. Deshpande |
2019-04-09 |
$21,845,000 |
| 10256205 |
Variable ball height on ball grid array packages by solder paste transfer |
Jimin Yao, Shawna M. Liff |
2019-04-09 |
$21,845,000 |
| 10249515 |
Electronic device package |
Jimin Yao, Shawna M. Liff |
2019-04-02 |
$26,887,000 |
| 10224290 |
Electromagnetically shielded electronic devices and related systems and methods |
Rajendra C. Dias, Takashi Kumamoto, Yoshishiro Tomita, Mitul Modi, Joshua D. Heppner |
2019-03-05 |
$19,977,000 |
| 10224223 |
Low temperature thin wafer backside vacuum process with backgrinding tape |
— |
2019-03-05 |
$19,977,000 |
