Issued Patents All Time
Showing 26–50 of 51 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163810 | Electromagnetic interference shielding for system-in-package technology | Yoshihiro Tomita, Nachiket R. Raravikar, Robert L. Sankman | 2018-12-25 |
| 10121722 | Architecture material and process to improve thermal performance of the embedded die package | Chandra Mohan Jha, Zhaozhi Li, Robert M. Nickerson | 2018-11-06 |
| 9991211 | Semiconductor package having an EMI shielding layer | Anna M. Prakash, Reynaldo A. Olmedo, Venmathy McMahan, Rajendra C. Dias, Joshua D. Heppner +2 more | 2018-06-05 |
| 9953929 | Systems and methods for electromagnetic interference shielding | Rajendra C. Dias, Anna M. Prakash, Joshua D. Heppner, Nachiket R. Raravikar | 2018-04-24 |
| 9922751 | Helically insulated twinax cable systems and methods | Zhichao Zhang, Gong Ouyang, Kai Xiao, Kemal Aygun | 2018-03-20 |
| 9847304 | Electronic device packages with conformal EMI shielding and related methods | Joshua D. Heppner, Rajendra C. Dias, Mitul Modi | 2017-12-19 |
| 9842818 | Variable ball height on ball grid array packages by solder paste transfer | Jimin Yao, Shawna M. Liff | 2017-12-12 |
| 9741692 | Methods to form high density through-mold interconnections | Omkar G. Karhade, Nitin A. Deshpande, Edvin Cetegen, Debendra Mallik, Bassam M. Ziadeh | 2017-08-22 |
| 9685413 | Semiconductor package having an EMI shielding layer | Anna M. Prakash, Reynaldo A. Olmedo, Venmathy McMahan, Rajendra C. Dias, Joshua D. Heppner +2 more | 2017-06-20 |
| 9659899 | Die warpage control for thin die assembly | Sandeep B. Sane, Shankar Ganapathysubramanian, Jorge Sanchez, Leonel Arana, Nitin A. Deshpande +2 more | 2017-05-23 |
| 9607964 | Method and materials for warpage thermal and interconnect solutions | Omkar G. Karhade, Nitin A. Deshpande, Aditya Sundoctor VAIDYA, Nachiket R. Raravikar | 2017-03-28 |
| 9390968 | Low temperature thin wafer backside vacuum process with backgrinding tape | — | 2016-07-12 |
| 9263329 | Methods of connecting a first electronic package to a second electronic package | Chia-Pin Chiu, Kinya Ichikawa, Yoshihiro Tomita, Robert L. Sankman | 2016-02-16 |
| 9123732 | Die warpage control for thin die assembly | Sandeep B. Sane, Shankar Ganapathysubramanian, Jorge Sanchez, Leonel Arana, Nitin A. Deshpande +2 more | 2015-09-01 |
| 8426250 | Laser-assisted chemical singulation of a wafer | George Vakanas, George Chen, Yuval Greenzweig, Sergei Voronov | 2013-04-23 |
| 8193072 | Semiconductor wafer coat layers and methods therefor | Daoqiang Lu, Christopher L. Rumer, Paul A. Koning, Darcy E. Fleming, Gudbjorg H. Oskarsdottir +1 more | 2012-06-05 |
| 7897486 | Semiconductor wafer coat layers and methods therefor | Daoqiang Lu, Christopher L. Rumer, Paul A. Koning, Darcy E. Fleming, Gudbjorg H. Oskarsdottir +1 more | 2011-03-01 |
| 7807573 | Laser assisted chemical vapor deposition for backside die marking and structures formed thereby | Sergei Voronov | 2010-10-05 |
| 7767563 | Method of forming a silicide layer on a thinned silicon wafer, and related semiconducting structure | — | 2010-08-03 |
| 7611966 | Dual pulsed beam laser micromachining method | Sergei Voronov, Christopher L. Rumer | 2009-11-03 |
| 7553386 | Adhesive with differential optical properties and its application for substrate processing | Daoqiang Lu | 2009-06-30 |
| 7504318 | Nanopowder coating for scribing and structures formed thereby | Daoqiang Lu, Tian-An Chen | 2009-03-17 |
| 7393468 | Adhesive with differential optical properties and its application for substrate processing | Daoqiang Lu | 2008-07-01 |
| 7279362 | Semiconductor wafer coat layers and methods therefor | Daoqiang Lu, Christopher L. Rumer, Paul A. Koning, Darcy E. Fleming, Gudbjorg H. Oskarsdottir +1 more | 2007-10-09 |
| 7169687 | Laser micromachining method | Sergei Voronov, Christopher L. Rumer | 2007-01-30 |