SG

Shankar Ganapathysubramanian

IN Intel: 8 patents #4,870 of 30,777Top 20%
AM Amazon: 7 patents #2,298 of 19,158Top 15%
Overall (All Time): #282,709 of 4,157,543Top 7%
16
Patents All Time

Issued Patents All Time

Showing 1–16 of 16 patents

Patent #TitleCo-InventorsDate
12225336 Systems and methods to secure fabric to speaker-based devices Xuan Geng, Susan Swindlehurst, Wentao Cheng 2025-02-11
9811188 Display stack Srivatsan Subbarayan, Guneet Sethi, Anoop Menon, Jorge Ferrer Pont, Weihsin Hou +2 more 2017-11-07
9659899 Die warpage control for thin die assembly Sandeep B. Sane, Jorge Sanchez, Leonel Arana, Eric J. Li, Nitin A. Deshpande +2 more 2017-05-23
9645064 Measurement of dynamic material properties Mohammed Aftab Alam, Ramez Nachman, Guruprasad Ramanathan 2017-05-09
9626024 Composite cover assembly for electronic devices Hung-Bing Tan, David Eric Peters, SHAN-YONG CHENG 2017-04-18
9529389 Variable plated device enclosure David Eric Peters, Mohammed Aftab Alam, Vikram Srinivas 2016-12-27
9442520 Resin-encapsulated portable media device Vikram Srinivas, Ali-Reza Bahmandar, Ramez Nachman, Patrick Tang 2016-09-13
9310836 Resin-encapsulated portable media device Vikram Srinivas, Ali-Reza Bahmandar, Ramez Nachman, Patrick Tang 2016-04-12
9258880 Package substrate and die spacer layers having a ceramic backbone Aleksandar Aleksov, Vladimir Noveski, Sujit Sharan 2016-02-09
9123732 Die warpage control for thin die assembly Sandeep B. Sane, Jorge Sanchez, Leonel Arana, Eric J. Li, Nitin A. Deshpande +2 more 2015-09-01
8604353 Package substrate and die spacer layers having a ceramic backbone Aleksandar Aleksov, Vladimir Noveski, Sujit Sharan 2013-12-10
8304065 Treatment for a microelectronic device and method of resisting damage to a microelectronic device using same Leonel Arana, Dingying Xu, Vijay Wakharkar, Wen Feng, Nirupama Chakrapani +2 more 2012-11-06
8186051 Method for fabricating package substrate and die spacer layers having a ceramic backbone Aleksandar Aleksov, Vladimir Noveski, Sujit Sharan 2012-05-29
7759780 Microelectronic package with wear resistant coating Nirupama Chakrapani, Vijay Wakharkar, Janet Feng, Nisha Ananthakrishnan, Gregory S. Constable 2010-07-20
7719109 Embedded capacitors for reducing package cracking Mitul Modi, Sudarshan Rangaraj, Richard J. Harries, Sankara J. Subramanian 2010-05-18
7692307 Compliant structure for an electronic device, method of manufacturing same, and system containing same Sudarshan Rangaraj, Richard J. Harries, Mitul Modi, Sankara J. Subramanian 2010-04-06