Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7719109 | Embedded capacitors for reducing package cracking | Mitul Modi, Shankar Ganapathysubramanian, Richard J. Harries, Sankara J. Subramanian | 2010-05-18 |
| 7692307 | Compliant structure for an electronic device, method of manufacturing same, and system containing same | Shankar Ganapathysubramanian, Richard J. Harries, Mitul Modi, Sankara J. Subramanian | 2010-04-06 |
| 7659192 | Methods of forming stepped bumps and structures formed thereby | Andrew Yeohi, Guotao Wang, Sairam Agraharam | 2010-02-09 |
| 7585693 | Method of forming a microelectronic package using control of die and substrate differential expansions and microelectronic package formed according to the method | Kristopher Frutschy, Kevin George | 2009-09-08 |
| 7288472 | Method and system for performing die attach using a flame | Kris Frutschy, Tom M. Lappin | 2007-10-30 |