| 12476174 |
Ultra-thin, hyper-density semiconductor packages |
Debendra Mallik, Robert L. Sankman, Robert M. Nickerson, Sanka Ganesan, Rajasekaran Swaminathan +4 more |
2025-11-18 |
|
| 12422615 |
Nested glass packaging architecture for hybrid electrical and optical communication devices |
Srinivas V. Pietambaram, Brandon C. Marin, Debendra Mallik, Tarek A. Ibrahim, Jeremy Ecton +5 more |
2025-09-23 |
|
| 12406914 |
Ultra-thin, hyper-density semiconductor packages |
Debendra Mallik, Robert L. Sankman, Robert M. Nickerson, Sanka Ganesan, Rajasekaran Swaminathan +4 more |
2025-09-02 |
|
| 12392970 |
Photonic integrated circuit packaging architectures |
Omkar G. Karhade, Xiaoqian Li, Nitin A. Deshpande, Ravindranath V. Mahajan, Srinivas V. Pietambaram +1 more |
2025-08-19 |
|
| 12261150 |
Mold shelf package design and process flow for advanced package architectures |
Wei Li, Edvin Cetegen, Nicholas S. Haehn, Ram Viswanath, Nicholas Neal |
2025-03-25 |
|
| 12176268 |
Open cavity bridge co-planar placement architectures and processes |
Omkar G. Karhade, Digvijay A. Raorane, Sairam Agraharam, Nitin A. Deshpande, Manish Dubey +1 more |
2024-12-24 |
$17,261,000 |
| 12087731 |
No mold shelf package design and process flow for advanced package architectures |
Wei Li, Edvin Cetegen, Nicholas S. Haehn, Ram Viswanath, Nicholas Neal |
2024-09-10 |
$16,964,000 |
| 12068222 |
Dummy die structures of a packaged integrated circuit device |
Joseph Van Nausdle, Omkar G. Karhade, Edvin Cetegen, Nicholas S. Haehn, Vaibhav Agrawal +4 more |
2024-08-20 |
$20,163,000 |
| 12040246 |
Chip-scale package architectures containing a die back side metal and a solder thermal interface material |
Susmriti Das Mahapatra, Malavarayan Sankarasubramanian, Shenavia S. Howell, John Harper |
2024-07-16 |
$26,089,000 |
| 12027448 |
Open cavity bridge power delivery architectures and processes |
Omkar G. Karhade, Sairam Agraharam, Nitin A. Deshpande, Digvijay A. Raorane |
2024-07-02 |
$27,114,000 |
| 11942393 |
Substrate with thermal insulation |
Wei Li, Edvin Cetegen, Nicholas S. Haehn, Nicholas Neal |
2024-03-26 |
$33,708,000 |
| 11901333 |
No mold shelf package design and process flow for advanced package architectures |
Wei Li, Edvin Cetegen, Nicholas S. Haehn, Ram Viswanath, Nicholas Neal |
2024-02-13 |
$18,546,000 |
| 11735495 |
Active package cooling structures using molded substrate packaging technology |
Omkar G. Karhade, Edvin Cetegen, Aastha Uppal |
2023-08-22 |
$16,803,000 |
| 11705377 |
Stacked die cavity package |
Robert L. Sankman, Debendra Mallik, Ravindranath V. Mahajan, Amruthavalli Pallavi Alur, Yikang Deng +1 more |
2023-07-18 |
$21,060,000 |
| 11611164 |
Wideband multi-pin edge connector for radio frequency front end module |
Zhenguo Jiang, Omkar G. Karhade, Sri Chaitra Jyotsna Chavali, William J. Lambert, Zhichao Zhang |
2023-03-21 |
$20,076,000 |
| 11574851 |
Coupled cooling fins in ultra-small systems |
Aastha Uppal, Omkar G. Karhade, Ram Viswanath, Je-Young Chang, Weihua Tang +6 more |
2023-02-07 |
$11,877,000 |
| 11545407 |
Thermal management solutions for integrated circuit packages |
Kumar Abhishek Singh, Omkar G. Karhade, Nitin A. Deshpande, Edvin Cetegen, Aastha Uppal +8 more |
2023-01-03 |
$15,575,000 |
| 11430724 |
Ultra-thin, hyper-density semiconductor packages |
Debendra Mallik, Robert L. Sankman, Robert M. Nickerson, Sanka Ganesan, Rajasekaran Swaminathan +4 more |
2022-08-30 |
$13,077,000 |
| 11417630 |
Semiconductor package having passive support wafer |
Debendra Mallik, Digvijay A. Raorane, Ravindranath V. Mahajan |
2022-08-16 |
$17,788,000 |
| 11328968 |
Stacked die cavity package |
Robert L. Sankman, Debendra Mallik, Ravindranath V. Mahajan, Amruthavalli Pallavi Alur, Yikang Deng +1 more |
2022-05-10 |
$19,182,000 |
| 11222877 |
Thermally coupled package-on-package semiconductor packages |
Omkar G. Karhade, Robert L. Sankman, Nitin A. Deshpande, Thomas J. De Bonis, Robert M. Nickerson +6 more |
2022-01-11 |
$33,310,000 |
| 11024559 |
Semiconductor package with electromagnetic interference shielding structures |
Joshua D. Heppner |
2021-06-01 |
$35,542,000 |
| 10910314 |
Conductive coating for a microelectronics package |
Li-Sheng Weng, Chung-Hao Chen, Emile Davies-Venn, Kemal Aygun |
2021-02-02 |
$28,243,000 |
| 10763220 |
Systems and methods for electromagnetic interference shielding |
Rajendra C. Dias |
2020-09-01 |
$24,773,000 |
| 10510667 |
Conductive coating for a microelectronics package |
Li-Sheng Weng, Chung-Hao Chen, Emile Davies-Venn, Kemal Aygun |
2019-12-17 |
$31,829,000 |
