Issued Patents All Time
Showing 25 most recent of 38 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12422615 | Nested glass packaging architecture for hybrid electrical and optical communication devices | Srinivas V. Pietambaram, Brandon C. Marin, Debendra Mallik, Tarek A. Ibrahim, Jeremy Ecton +5 more | 2025-09-23 |
| 12406914 | Ultra-thin, hyper-density semiconductor packages | Debendra Mallik, Robert L. Sankman, Robert M. Nickerson, Sanka Ganesan, Rajasekaran Swaminathan +4 more | 2025-09-02 |
| 12392970 | Photonic integrated circuit packaging architectures | Omkar G. Karhade, Xiaoqian Li, Nitin A. Deshpande, Ravindranath V. Mahajan, Srinivas V. Pietambaram +1 more | 2025-08-19 |
| 12261150 | Mold shelf package design and process flow for advanced package architectures | Wei Li, Edvin Cetegen, Nicholas S. Haehn, Ram Viswanath, Nicholas Neal | 2025-03-25 |
| 12176268 | Open cavity bridge co-planar placement architectures and processes | Omkar G. Karhade, Digvijay A. Raorane, Sairam Agraharam, Nitin A. Deshpande, Manish Dubey +1 more | 2024-12-24 |
| 12087731 | No mold shelf package design and process flow for advanced package architectures | Wei Li, Edvin Cetegen, Nicholas S. Haehn, Ram Viswanath, Nicholas Neal | 2024-09-10 |
| 12068222 | Dummy die structures of a packaged integrated circuit device | Joseph Van Nausdle, Omkar G. Karhade, Edvin Cetegen, Nicholas S. Haehn, Vaibhav Agrawal +4 more | 2024-08-20 |
| 12040246 | Chip-scale package architectures containing a die back side metal and a solder thermal interface material | Susmriti Das Mahapatra, Malavarayan Sankarasubramanian, Shenavia S. Howell, John Harper | 2024-07-16 |
| 12027448 | Open cavity bridge power delivery architectures and processes | Omkar G. Karhade, Sairam Agraharam, Nitin A. Deshpande, Digvijay A. Raorane | 2024-07-02 |
| 11942393 | Substrate with thermal insulation | Wei Li, Edvin Cetegen, Nicholas S. Haehn, Nicholas Neal | 2024-03-26 |
| 11901333 | No mold shelf package design and process flow for advanced package architectures | Wei Li, Edvin Cetegen, Nicholas S. Haehn, Ram Viswanath, Nicholas Neal | 2024-02-13 |
| 11735495 | Active package cooling structures using molded substrate packaging technology | Omkar G. Karhade, Edvin Cetegen, Aastha Uppal | 2023-08-22 |
| 11705377 | Stacked die cavity package | Robert L. Sankman, Debendra Mallik, Ravindranath V. Mahajan, Amruthavalli Pallavi Alur, Yikang Deng +1 more | 2023-07-18 |
| 11611164 | Wideband multi-pin edge connector for radio frequency front end module | Zhenguo Jiang, Omkar G. Karhade, Sri Chaitra Jyotsna Chavali, William J. Lambert, Zhichao Zhang | 2023-03-21 |
| 11574851 | Coupled cooling fins in ultra-small systems | Aastha Uppal, Omkar G. Karhade, Ram Viswanath, Je-Young Chang, Weihua Tang +6 more | 2023-02-07 |
| 11545407 | Thermal management solutions for integrated circuit packages | Kumar Abhishek Singh, Omkar G. Karhade, Nitin A. Deshpande, Edvin Cetegen, Aastha Uppal +8 more | 2023-01-03 |
| 11430724 | Ultra-thin, hyper-density semiconductor packages | Debendra Mallik, Robert L. Sankman, Robert M. Nickerson, Sanka Ganesan, Rajasekaran Swaminathan +4 more | 2022-08-30 |
| 11417630 | Semiconductor package having passive support wafer | Debendra Mallik, Digvijay A. Raorane, Ravindranath V. Mahajan | 2022-08-16 |
| 11328968 | Stacked die cavity package | Robert L. Sankman, Debendra Mallik, Ravindranath V. Mahajan, Amruthavalli Pallavi Alur, Yikang Deng +1 more | 2022-05-10 |
| 11222877 | Thermally coupled package-on-package semiconductor packages | Omkar G. Karhade, Robert L. Sankman, Nitin A. Deshpande, Thomas J. De Bonis, Robert M. Nickerson +6 more | 2022-01-11 |
| 11024559 | Semiconductor package with electromagnetic interference shielding structures | Joshua D. Heppner | 2021-06-01 |
| 10910314 | Conductive coating for a microelectronics package | Li-Sheng Weng, Chung-Hao Chen, Emile Davies-Venn, Kemal Aygun | 2021-02-02 |
| 10763220 | Systems and methods for electromagnetic interference shielding | Rajendra C. Dias | 2020-09-01 |
| 10510667 | Conductive coating for a microelectronics package | Li-Sheng Weng, Chung-Hao Chen, Emile Davies-Venn, Kemal Aygun | 2019-12-17 |
| 10325866 | Electronic device packages with conformal EMI shielding and related methods | Eric J. Li, Joshua D. Heppner, Rajendra C. Dias | 2019-06-18 |