Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11295998 | Stiffener and package substrate for a semiconductor package | Stephen Christianson, Stephen H. Hall, Dong-Ho Han, Kemal Aygun, Konika Ganguly +4 more | 2022-04-05 |
| 10910314 | Conductive coating for a microelectronics package | Li-Sheng Weng, Chung-Hao Chen, Kemal Aygun, Mitul Modi | 2021-02-02 |
| 10510667 | Conductive coating for a microelectronics package | Li-Sheng Weng, Chung-Hao Chen, Kemal Aygun, Mitul Modi | 2019-12-17 |
| 9520350 | Bumpless build-up layer (BBUL) semiconductor package with ultra-thin dielectric layer | Weng Hong Teh, Ebrahim Andideh, Digvijay A. Raorane, Daniel N. Sobieski | 2016-12-13 |
| 8804366 | Package-based filtering and matching solutions | Telesphor Kamgaing | 2014-08-12 |
| 8111521 | Package-based filtering and matching solutions | Telesphor Kamgaing | 2012-02-07 |
| 7626472 | Package embedded three dimensional balun | Telesphor Kamgaing | 2009-12-01 |