Issued Patents All Time
Showing 25 most recent of 38 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12426153 | Twisted differential compensation for routing high-speed signals near power delivery inductors and system miniaturization | Long Wang, Ranjul Balakrishnan | 2025-09-23 |
| 11955436 | Self-equalized and self-crosstalk-compensated 3D transmission line architecture with array of periodic bumps for high-speed single-ended signal transmission | Khang Choong Yong, Ying Ern Ho, Yun Rou Lim, Wil Choon Song | 2024-04-09 |
| 11729900 | Pattern-edged metal-plane resonance-suppression | Khang Choong Yong, Ying Ern Ho, Yun Rou Lim, Wil Choon Song | 2023-08-15 |
| 11295998 | Stiffener and package substrate for a semiconductor package | Stephen Christianson, Emile Davies-Venn, Dong-Ho Han, Kemal Aygun, Konika Ganguly +4 more | 2022-04-05 |
| 11290059 | Crystal oscillator interconnect architecture with noise immunity | Khang Choong Yong, Raymond Chong, Ramaswamy Parthasarathy, Chin Lee Kuan | 2022-03-29 |
| 11277903 | Pattern-edged metal-plane resonance-suppression | Khang Choong Yong, Ying Ern Ho, Yun Rou Lim, Wil Choon Song | 2022-03-15 |
| 11178768 | Flexible printed circuit EMI enclosure | Khang Choong Yong, Tin Poay Chuah, Boon Ping Koh, Eng Huat Goh | 2021-11-16 |
| 10886209 | Multiple-layer, self-equalizing interconnects in package substrates | Bok Eng Cheah, Chaitanya Sreerama, Jackson Chung Peng Kong | 2021-01-05 |
| 10877559 | System to provide tactile feedback during non-contact interaction | Kevin J. Doran, Murali Veeramoney, Vijay Rao, Royce Fernald | 2020-12-29 |
| 10856407 | Transmission line design with routing-over-void compensation | Khang Choong Yong, Bok Eng Cheah, Jackson Chung Peng Kong, Yun Rou Lim | 2020-12-01 |
| 10652999 | Mutual inductance suppressor for crosstalk immunity enhancement | Khang Choong Yong, Jackson Chung Peng Kong, Bok Eng Cheah | 2020-05-12 |
| 10516366 | Crystal oscillator interconnect architecture with noise immunity | Khang Choong Yong, Raymond Chong, Ramaswamy Parthasarathy, Chin Lee Kuan | 2019-12-24 |
| 10484231 | Routing-over-void-T-line-compensation | Khang Choong Yong, Bok Eng Cheah, Jackson Chung Peng Kong, Yun Rou Lim | 2019-11-19 |
| 10354957 | Electrical interconnect for a flexible electronic package | Bok Eng Cheah, Jackson Chung Peng Kong, Khang Choong Yong, Kooi Chi Ooi, Eric C Gantner | 2019-07-16 |
| 10171033 | Crystal oscillator interconnect architecture with noise immunity | Khang Choong Yong, Raymond Chong, Ramaswamy Parthasarathy, Chin Lee Kuan | 2019-01-01 |
| 10078612 | Mode selective balanced encoded interconnect | Michael W. Leddige, Chaitanya Sreerama, Olufemi B. Oluwafemi, Antonio Zenteno Ramirez, Maynard C. Falconer | 2018-09-18 |
| 10073807 | Logic-based decoder for crosstalk-harnessed signaling | Chaitanya Sreerama | 2018-09-11 |
| 9632961 | Crosstalk aware decoding for a data bus | Olufemi B. Oluwafemi, Jason A. Mix, Earl J. Wight, Chaitanya Sreerama, Michael W. Leddige +1 more | 2017-04-25 |
| 9552995 | Electrical interconnect for an electronic package | Khang Choong Yong, Bok Eng Cheah, Teong Keat Beh, Howard L. Heck, Jackson Chung Peng Kong +1 more | 2017-01-24 |
| 9515402 | Structures for edge-to-edge coupling with flexible circuitry | Xiang Li | 2016-12-06 |
| 9330039 | Crosstalk aware encoding for a data bus | Chaitanya Sreerama, Jason A. Mix, Michael W. Leddige, Jose A. Sanchez Sanchez, Olufemi B. Oluwafemi +2 more | 2016-05-03 |
| 8732942 | Method of forming a high speed interconnect | Bryce Horine, Gary A. Brist, Howard L. Heck | 2014-05-27 |
| 7977581 | Shifted segment layout for differential signal traces to mitigate bundle weave effect | Tao Liang, Howard L. Heck, Gary A. Brist, Bryce Horine | 2011-07-12 |
| 7800459 | Ultra-high bandwidth interconnect for data transmission | Michael White, Howard L. Heck, Bryce Horine | 2010-09-21 |
| 7761057 | Managing system clocks to reduce RFI | Chaitanya Sreerama, Michael E. Deisher, Keith R. Tinsley, Harry G. Skinner | 2010-07-20 |