| 10309781 |
Computing a magnetic heading |
Kevin J. Daniel |
2019-06-04 |
$21,702,000 |
| 9939497 |
Dynamically calibrating magnetic sensors |
Kevin J. Daniel, Melissa A. Cowan |
2018-04-10 |
$20,820,000 |
| 9872397 |
Symmetrical hexagonal-based ball grid array pattern |
— |
2018-01-16 |
$17,139,000 |
| 9816814 |
Magnetometer unit for electronic devices |
Kevin J. Daniel |
2017-11-14 |
$11,178,000 |
| 8732942 |
Method of forming a high speed interconnect |
Stephen H. Hall, Bryce Horine, Howard L. Heck |
2014-05-27 |
$13,313,000 |
| 8307548 |
Method of making a fiber reinforced printed circuit board panel and a fiber reinforced panel made according to the method |
William Alger, Gary Long, Bryce Horine |
2012-11-13 |
$15,347,000 |
| 8299369 |
Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery |
Gary Long, Daryl Sato |
2012-10-30 |
|
| 8056221 |
Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery |
Gary Long, Daryl Sato |
2011-11-15 |
$27,540,000 |
| 7977581 |
Shifted segment layout for differential signal traces to mitigate bundle weave effect |
Tao Liang, Stephen H. Hall, Howard L. Heck, Bryce Horine |
2011-07-12 |
$25,282,000 |
| 7843057 |
Method of making a fiber reinforced printed circuit board panel and a fiber reinforced panel made according to the method |
William Alger, Gary Long, Bryce Horine |
2010-11-30 |
$13,201,000 |
| 7797826 |
Method of power-ground plane partitioning to utilize channel/trenches |
Gary Long, Daryl Sato |
2010-09-21 |
$10,255,000 |
| 7785114 |
Modification of connections between a die package and a system board |
Tom Ruttan, Ted Zarbock |
2010-08-31 |
$9,647,000 |
| 7723618 |
Shifted segment layout for differential signal traces to mitigate bundle weave effect |
Tao Liang, Stephen H. Hall, Howard L. Heck, Bryce Horine |
2010-05-25 |
$11,401,000 |
| 7691458 |
Carrier substrate with a thermochromatic coating |
Patrick D. Boyd |
2010-04-06 |
$11,081,000 |
| 7630601 |
Connecting a component with an embedded optical fiber |
Jayne Mershon, William Alger, Gary Long |
2009-12-08 |
$15,228,000 |
| 7495623 |
Modular waveguide inteconnect |
Bryce Horine, Stephen H. Hall, Peter Davison |
2009-02-24 |
|
| 7480435 |
Embedded waveguide printed circuit board structure |
Bryce Horine, Stephen H. Stephen |
2009-01-20 |
$15,289,000 |
| 7427719 |
Shifted segment layout for differential signal traces to mitigate bundle weave effect |
Tao Liang, Stephen H. Hall, Howard L. Heck, Bryce Horine |
2008-09-23 |
$21,762,000 |
| 7373068 |
Connecting a component with an embedded optical fiber |
Jayne Mershon, William Alger, Gary Long, Michael Beckman |
2008-05-13 |
$17,373,000 |
| 7361842 |
Apparatus and method for an embedded air dielectric for a package and a printed circuit board |
William Alger, Gary Long, Jayne Mershon, Michael Beckman |
2008-04-22 |
$13,499,000 |
| 7343576 |
Conductor trace design to reduce common mode cross-talk and timing skew |
Gary Long, William Alger, Carlos Mejia, Bryce Horine |
2008-03-11 |
$19,082,000 |
| 7269899 |
Method for creating power-ground plane partitioning and via connection to utilize channel/trenches for power delivery |
Gary Long, Daryl Sato |
2007-09-18 |
$14,997,000 |
| 7271680 |
Method, apparatus, and system for parallel plate mode radial pattern signaling |
Stephen H. Hall, Tao Liang, Howard L. Heck, Bryce Horine |
2007-09-18 |
$14,997,000 |
| 7249955 |
Connection of package, board, and flex cable |
Bryce Horine |
2007-07-31 |
$23,850,000 |
| 7234947 |
Electrical socket with compressible domed contacts |
William Alger, Gary Long, Jayne Mershon, Michael Beckman |
2007-06-26 |
$20,503,000 |
