| 8299369 |
Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery |
Gary A. Brist, Gary Long |
2012-10-30 |
|
| 8056221 |
Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery |
Gary A. Brist, Gary Long |
2011-11-15 |
$27,540,000 |
| 7797826 |
Method of power-ground plane partitioning to utilize channel/trenches |
Gary A. Brist, Gary Long |
2010-09-21 |
$10,255,000 |
| 7583513 |
Apparatus for providing an integrated printed circuit board registration coupon |
David Boggs, John Dungan |
2009-09-01 |
$29,239,000 |
| 7385288 |
Electronic packaging using conductive interproser connector |
David Boggs, John Dungan, Frank A. Sanders, Dan Willis |
2008-06-10 |
$23,380,000 |
| 7325303 |
Three-dimensional flexible interposer |
David Boggs, John Dungan, Frank A. Sanders, Dan Willis |
2008-02-05 |
$13,136,000 |
| 7269899 |
Method for creating power-ground plane partitioning and via connection to utilize channel/trenches for power delivery |
Gary A. Brist, Gary Long |
2007-09-18 |
$14,997,000 |
| 7241680 |
Electronic packaging using conductive interposer connector |
David Boggs, John Dungan, Frank A. Sanders, Dan Willis |
2007-07-10 |
$14,625,000 |
| 7201583 |
Three-dimensional flexible interposer |
David Boggs, John Dungan, Frank A. Sanders, Dan Willis |
2007-04-10 |
$13,767,000 |
| 7147141 |
Preconditioning via plug material for a via-in-pad ball grid array package |
Gary Paek, John Dungan, David Boggs |
2006-12-12 |
$16,980,000 |
| 7145243 |
Photo-thermal induced diffusion |
Gary A. Brist, Gary Long |
2006-12-05 |
$16,671,000 |
| 7084354 |
PCB method and apparatus for producing landless interconnects |
David Boggs, John Dungan, Gary Paek |
2006-08-01 |
$14,842,000 |
| 7064063 |
Photo-thermal induced diffusion |
Gary A. Brist, Gary Long |
2006-06-20 |
$13,743,000 |
| 7061116 |
Arrangement of vias in a substrate to support a ball grid array |
Carolyn R. McCormick, Rebecca Jessep, John Dungan, David Boggs |
2006-06-13 |
$12,187,000 |
| 7061095 |
Printed circuit board conductor channeling |
David Boggs, Rebecca Jessep, Carolyn R. McCormick |
2006-06-13 |
$12,187,000 |
| 6941537 |
Standoff devices and methods of using same |
Rebecca Jessep, David Boggs, Carolyn R. McCormick, John Dungan |
2005-09-06 |
$17,626,000 |
| 6787443 |
PCB design and method for providing vented blind vias |
David Boggs, John Dungan, Gary Paek |
2004-09-07 |
$21,424,000 |
| 6747216 |
Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery |
Gary A. Brist, Gary Long |
2004-06-08 |
$20,315,000 |
| 6667090 |
Coupon registration mechanism and method |
David Boggs, Rebecca Jessep, Carolyn R. McCormick, John Dungan |
2003-12-23 |
$55,491,000 |
| 6642158 |
Photo-thermal induced diffusion |
Gary A. Brist, Gary Long |
2003-11-04 |
$42,713,000 |
| 6580174 |
Vented vias for via in pad technology yield improvements |
Carolyn R. McCormick, Rebecca Jessep, John Dungan, David Boggs |
2003-06-17 |
$57,598,000 |
