Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8299369 | Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery | Gary A. Brist, Gary Long | 2012-10-30 |
| 8056221 | Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery | Gary A. Brist, Gary Long | 2011-11-15 |
| 7797826 | Method of power-ground plane partitioning to utilize channel/trenches | Gary A. Brist, Gary Long | 2010-09-21 |
| 7583513 | Apparatus for providing an integrated printed circuit board registration coupon | David Boggs, John Dungan | 2009-09-01 |
| 7385288 | Electronic packaging using conductive interproser connector | David Boggs, John Dungan, Frank A. Sanders, Dan Willis | 2008-06-10 |
| 7325303 | Three-dimensional flexible interposer | David Boggs, John Dungan, Frank A. Sanders, Dan Willis | 2008-02-05 |
| 7269899 | Method for creating power-ground plane partitioning and via connection to utilize channel/trenches for power delivery | Gary A. Brist, Gary Long | 2007-09-18 |
| 7241680 | Electronic packaging using conductive interposer connector | David Boggs, John Dungan, Frank A. Sanders, Dan Willis | 2007-07-10 |
| 7201583 | Three-dimensional flexible interposer | David Boggs, John Dungan, Frank A. Sanders, Dan Willis | 2007-04-10 |
| 7147141 | Preconditioning via plug material for a via-in-pad ball grid array package | Gary Paek, John Dungan, David Boggs | 2006-12-12 |
| 7145243 | Photo-thermal induced diffusion | Gary A. Brist, Gary Long | 2006-12-05 |
| 7084354 | PCB method and apparatus for producing landless interconnects | David Boggs, John Dungan, Gary Paek | 2006-08-01 |
| 7064063 | Photo-thermal induced diffusion | Gary A. Brist, Gary Long | 2006-06-20 |
| 7061116 | Arrangement of vias in a substrate to support a ball grid array | Carolyn R. McCormick, Rebecca Jessep, John Dungan, David Boggs | 2006-06-13 |
| 7061095 | Printed circuit board conductor channeling | David Boggs, Rebecca Jessep, Carolyn R. McCormick | 2006-06-13 |
| 6941537 | Standoff devices and methods of using same | Rebecca Jessep, David Boggs, Carolyn R. McCormick, John Dungan | 2005-09-06 |
| 6787443 | PCB design and method for providing vented blind vias | David Boggs, John Dungan, Gary Paek | 2004-09-07 |
| 6747216 | Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery | Gary A. Brist, Gary Long | 2004-06-08 |
| 6667090 | Coupon registration mechanism and method | David Boggs, Rebecca Jessep, Carolyn R. McCormick, John Dungan | 2003-12-23 |
| 6642158 | Photo-thermal induced diffusion | Gary A. Brist, Gary Long | 2003-11-04 |
| 6580174 | Vented vias for via in pad technology yield improvements | Carolyn R. McCormick, Rebecca Jessep, John Dungan, David Boggs | 2003-06-17 |