Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
DB

David Boggs — 19 Patents

Intel: 13 patents #3,167 of 30,777Top 15%
Tektronix: 1 patents #823 of 1,698Top 50%
AVAvaya: 1 patents #1,063 of 1,730Top 65%
Hillsboro, OR: #231 of 2,365 inventorsTop 10%
Oregon: #2,295 of 28,073 inventorsTop 9%
Overall (All Time): #229,345 of 4,157,543Top 6%
19 Patents All Time
David Boggs has been granted 19 US patents while listed as an inventor at Intel. The first was granted in 1990 and the most recent in December 2024. David Boggs ranks #229,345 of 4,157,543 US inventors in our database (top 5.5%). Patent records list David Boggs in Hillsboro, OR, US.

Issued Patents All Time

Showing 1–19 of 19 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
12158891 System and method for managing cognate specifications of goods James Orr, Thomas Vaughan 2024-12-03
11847129 System and method for managing cognate specifications of goods James Orr, Thomas Vaughan 2023-12-19
11308113 System and method for managing cognate specifications of goods James Orr, Thomas Vaughan 2022-04-19
8199922 Ethernet isolator for microphonics security and method thereof David Render, Marc Saunders, Dennis POTHIER, Philip R. Ruttan 2012-06-12
7583513 Apparatus for providing an integrated printed circuit board registration coupon John Dungan, Daryl Sato 2009-09-01 $29,239,000
7385288 Electronic packaging using conductive interproser connector John Dungan, Frank A. Sanders, Daryl Sato, Dan Willis 2008-06-10 $23,380,000
7325303 Three-dimensional flexible interposer John Dungan, Frank A. Sanders, Daryl Sato, Dan Willis 2008-02-05 $13,136,000
7241680 Electronic packaging using conductive interposer connector John Dungan, Frank A. Sanders, Daryl Sato, Dan Willis 2007-07-10 $14,625,000
7201583 Three-dimensional flexible interposer John Dungan, Frank A. Sanders, Daryl Sato, Dan Willis 2007-04-10 $13,767,000
7147141 Preconditioning via plug material for a via-in-pad ball grid array package Daryl Sato, Gary Paek, John Dungan 2006-12-12 $16,980,000
7084354 PCB method and apparatus for producing landless interconnects Daryl Sato, John Dungan, Gary Paek 2006-08-01 $14,842,000
7061095 Printed circuit board conductor channeling Rebecca Jessep, Carolyn R. McCormick, Daryl Sato 2006-06-13 $12,187,000
7061116 Arrangement of vias in a substrate to support a ball grid array Carolyn R. McCormick, Rebecca Jessep, John Dungan, Daryl Sato 2006-06-13 $12,187,000
6941537 Standoff devices and methods of using same Rebecca Jessep, Carolyn R. McCormick, John Dungan, Daryl Sato 2005-09-06 $17,626,000
6787443 PCB design and method for providing vented blind vias John Dungan, Gary Paek, Daryl Sato 2004-09-07 $21,424,000
6667090 Coupon registration mechanism and method Rebecca Jessep, Carolyn R. McCormick, Daryl Sato, John Dungan 2003-12-23 $55,491,000
6641402 Method and apparatus for training memory 2003-11-04
6580174 Vented vias for via in pad technology yield improvements Carolyn R. McCormick, Rebecca Jessep, John Dungan, Daryl Sato 2003-06-17 $57,598,000
4935584 Method of fabricating a printed circuit board and the PCB produced 1990-06-19 $3,234,000