| 7583513 |
Apparatus for providing an integrated printed circuit board registration coupon |
David Boggs, Daryl Sato |
2009-09-01 |
| 7385288 |
Electronic packaging using conductive interproser connector |
David Boggs, Frank A. Sanders, Daryl Sato, Dan Willis |
2008-06-10 |
| 7325303 |
Three-dimensional flexible interposer |
David Boggs, Frank A. Sanders, Daryl Sato, Dan Willis |
2008-02-05 |
| 7241680 |
Electronic packaging using conductive interposer connector |
David Boggs, Frank A. Sanders, Daryl Sato, Dan Willis |
2007-07-10 |
| 7201583 |
Three-dimensional flexible interposer |
David Boggs, Frank A. Sanders, Daryl Sato, Dan Willis |
2007-04-10 |
| 7147141 |
Preconditioning via plug material for a via-in-pad ball grid array package |
Daryl Sato, Gary Paek, David Boggs |
2006-12-12 |
| 7084354 |
PCB method and apparatus for producing landless interconnects |
David Boggs, Daryl Sato, Gary Paek |
2006-08-01 |
| 7061116 |
Arrangement of vias in a substrate to support a ball grid array |
Carolyn R. McCormick, Rebecca Jessep, David Boggs, Daryl Sato |
2006-06-13 |
| 6941537 |
Standoff devices and methods of using same |
Rebecca Jessep, David Boggs, Carolyn R. McCormick, Daryl Sato |
2005-09-06 |
| 6787443 |
PCB design and method for providing vented blind vias |
David Boggs, Gary Paek, Daryl Sato |
2004-09-07 |
| 6667090 |
Coupon registration mechanism and method |
David Boggs, Rebecca Jessep, Carolyn R. McCormick, Daryl Sato |
2003-12-23 |
| 6580174 |
Vented vias for via in pad technology yield improvements |
Carolyn R. McCormick, Rebecca Jessep, David Boggs, Daryl Sato |
2003-06-17 |