Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9516752 | Underfill device and method | Patricia Brusso, Mitul Modi, Ruben Cadena, Sankara J. Subramanian, Edward L. Martin | 2016-12-06 |
| 8399291 | Underfill device and method | Patricia Brusso, Mitul Modi, Ruben Cadena, Sankara J. Subramanian, Edward L. Martin | 2013-03-19 |
| 7633142 | Flexible core for enhancement of package interconnect reliability | Mitul Modi, Patricia Brusso, Ruben Cadena, Sankara J. Subramanian | 2009-12-15 |
| 7352061 | Flexible core for enhancement of package interconnect reliability | Mitul Modi, Patricia Brusso, Ruben Cadena, Sankara J. Subramanian | 2008-04-01 |
| 7271349 | Via shielding for power/ground layers on printed circuit board | Rebecca Jessep, Terrance Dishongh, Thomas Morgan | 2007-09-18 |
| 7168164 | Methods for forming via shielding | Rebecca Jessep, Terrance Dishongh, Thomas Morgan | 2007-01-30 |
| 7061095 | Printed circuit board conductor channeling | David Boggs, Rebecca Jessep, Daryl Sato | 2006-06-13 |
| 7061116 | Arrangement of vias in a substrate to support a ball grid array | Rebecca Jessep, John Dungan, David Boggs, Daryl Sato | 2006-06-13 |
| 7036217 | Methods of manufacturing via intersect pad for electronic components | Tom E. Pearson, Jayne Mershon | 2006-05-02 |
| 6941537 | Standoff devices and methods of using same | Rebecca Jessep, David Boggs, John Dungan, Daryl Sato | 2005-09-06 |
| 6927346 | Surface mount technology to via-in-pad interconnections | Terrance Dishongh | 2005-08-09 |
| 6667090 | Coupon registration mechanism and method | David Boggs, Rebecca Jessep, Daryl Sato, John Dungan | 2003-12-23 |
| 6630631 | Apparatus and method for interconnection between a component and a printed circuit board | Terrance Dishongh | 2003-10-07 |
| 6580174 | Vented vias for via in pad technology yield improvements | Rebecca Jessep, John Dungan, David Boggs, Daryl Sato | 2003-06-17 |
| 6509530 | Via intersect pad for electronic components and methods of manufacture | Tom E. Pearson, Jayne Mershon | 2003-01-21 |