Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12426153 | Twisted differential compensation for routing high-speed signals near power delivery inductors and system miniaturization | Long Wang, Stephen H. Hall | 2025-09-23 |
| 12349274 | Low profile SODIMM (small outline dual inline memory module) | Raghavendra R. Rao, Shailendra Singh Chauhan, Sandesh Krishnamurthy Geejagaaru | 2025-07-01 |
| 12336088 | Inductive coupling structures for reducing cross talk effects in parallel bus technologies | Roman Meltser, Prabhat Ranjan, Shivani R. Jain | 2025-06-17 |
| 11600544 | Chip package with staggered pin pattern | Yogasundaram Chandiran, Geejagaaru Krishnamurthy Sandesh, Pradeep Vallanur Ramesh | 2023-03-07 |
| 11363717 | Inductor array and support | Jackson Chung Peng Kong, Bok Eng Cheah | 2022-06-14 |
| 10734393 | Methods of forming package structures for enhanced memory capacity and structures formed thereby | Navneet Singh, Shanto A. Thomas | 2020-08-04 |
| 10720407 | Microelectronic interposer for a microelectronic package | Navneet Singh | 2020-07-21 |
| 10608311 | Cable assembly comprising a single wire coupled to a signal launcher and housed in a first cover portion and in a second ferrite cover portion | Arvind Sundaram, Ramaswamy Parthasarathy, Vikas Mishra | 2020-03-31 |
| 10199353 | Microelectronic interposer for a microelectronic package | Navneet Singh | 2019-02-05 |
| 10177161 | Methods of forming package structures for enhanced memory capacity and structures formed thereby | Navneet Singh, Shanto A. Thomas | 2019-01-08 |