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USPTO Patent Rankings Data through Dec 31, 2025
Home › Intel › Ranjul Balakrishnan
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Ranjul Balakrishnan — 11 Patents

Intel: 11 patents #3,726 of 30,777Top 15%
Kanchinakote, IN: #526 of 5,961 inventorsTop 9%
Overall (All Time): #435,149 of 4,157,543Top 15%
11 Patents All Time
Ranjul Balakrishnan has been granted 11 US patents while listed as an inventor at Intel. The first was granted in 2019 and the most recent in November 2025. Ranjul Balakrishnan ranks #435,149 of 4,157,543 US inventors in our database (top 10.5%). Patent records list Ranjul Balakrishnan in Kanchinakote, IN.

Patents per Year

Patents granted per year, 2019 to 2025Bar chart with a peak of 4 patents in 2025.peak 42019: 2 patents20192020: 3 patents20202022: 1 patents20222023: 1 patents20232025: 4 patents2025

Issued Patents All Time

Showing 1–11 of 11 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
12484160 Technologies for shielding an inductor on a circuit board Sandesh Geejagaaru KRISHNAMURTHY, Jackson C.P. Kong 2025-11-25
12426153 Twisted differential compensation for routing high-speed signals near power delivery inductors and system miniaturization Long Wang, Stephen H. Hall 2025-09-23
12349274 Low profile SODIMM (small outline dual inline memory module) Raghavendra R. Rao, Shailendra Singh Chauhan, Sandesh Krishnamurthy Geejagaaru 2025-07-01
12336088 Inductive coupling structures for reducing cross talk effects in parallel bus technologies Roman Meltser, Prabhat Ranjan, Shivani R. Jain 2025-06-17
11600544 Chip package with staggered pin pattern Yogasundaram Chandiran, Geejagaaru Krishnamurthy Sandesh, Pradeep Vallanur Ramesh 2023-03-07 $16,825,000
11363717 Inductor array and support Jackson Chung Peng Kong, Bok Eng Cheah 2022-06-14 $16,878,000
10734393 Methods of forming package structures for enhanced memory capacity and structures formed thereby Navneet Singh, Shanto A. Thomas 2020-08-04 $32,661,000
10720407 Microelectronic interposer for a microelectronic package Navneet Singh 2020-07-21 $33,796,000
10608311 Cable assembly comprising a single wire coupled to a signal launcher and housed in a first cover portion and in a second ferrite cover portion Arvind Sundaram, Ramaswamy Parthasarathy, Vikas Mishra 2020-03-31 $34,068,000
10199353 Microelectronic interposer for a microelectronic package Navneet Singh 2019-02-05 $24,217,000
10177161 Methods of forming package structures for enhanced memory capacity and structures formed thereby Navneet Singh, Shanto A. Thomas 2019-01-08 $28,117,000

Frequent Collaborators

Navneet Singh4 shared
Shanto A. Thomas2 shared
Arvind Sundaram1 shared
Pradeep Vallanur Ramesh1 shared
Sandesh Krishnamurthy Geejagaaru1 shared
Prabhat Ranjan1 shared

Nearby-Ranked Inventors

Ya-Ching Chang11
Hermann Lubbert11
Alexander WAITE11
Mehrad Mehr11
Matthew J. Purdey11
Nishtha Madaan11
Ian C. Richards11
Chad Huffman11
Lifeng Fan11