| 12512414 |
Vertical interconnect design for improved electrical performance |
Jackson Chung Peng Kong, Kok Hou TEH, Kooi Chi Ooi, Li Wern Chew |
2025-12-30 |
|
| 12500175 |
Integrated bridge frame for package substrate |
Seok Ling Lim, Jenny Shio Yin Ong, Jackson Chung Peng Kong, Kooi Chi Ooi |
2025-12-16 |
|
| 12412784 |
Recessed vertical interconnects for device miniaturization |
Yee Lun Ong, Teong Guan Yew, Jackson Chung Peng Kong |
2025-09-09 |
|
| 12328816 |
Asymmetrical laminated circuit boards for improved electrical performance |
Jackson Chung Peng Kong, Tin Poay Chuah, Jenny Shio Yin Ong, Seok Ling Lim |
2025-06-10 |
|
| 12288740 |
Semiconductor package with hybrid mold layers |
Chia-Chuan Wu, Jackson Chung Peng Kong, Kooi Chi Ooi |
2025-04-29 |
|
| 12256487 |
Hybrid boards with embedded planes |
Jackson Chung Peng Kong, Jenny Shio Yin Ong, Seok Ling Lim, Chin Lee Kuan, Tin Poay Chuah |
2025-03-18 |
|
| 12218064 |
Molded silicon interconnects in bridges for integrated-circuit packages |
Jenny Shio Yin Ong, Seok Ling Lim, Jackson Chung Peng Kong, Kooi Chi Ooi |
2025-02-04 |
|
| 12191281 |
Multi-chip package with recessed memory |
Yang Liang Poh, Seok Ling Lim, Jenny Shio Yin Ong, Jackson Chung Peng Kong |
2025-01-07 |
|
| 12183722 |
Molded interconnects in bridges for integrated-circuit packages |
Jenny Shio Yin Ong, Seok Ling Lim, Jackson Chung Peng Kong |
2024-12-31 |
$16,542,000 |
| 12142570 |
Composite bridge die-to-die interconnects for integrated-circuit packages |
Jackson Chung Peng Kong, Jenny Shio Yin Ong, Ping Ping Ooi, Seok Ling Lim |
2024-11-12 |
$28,491,000 |
| 12112997 |
Micro through-silicon via for transistor density scaling |
Choong Kooi Chee, Jackson Chung Peng Kong, Wai Ling Lee, Tat Hin Tan |
2024-10-08 |
$19,971,000 |
| 12080628 |
Micro through-silicon via for transistor density scaling |
Choong Kooi Chee, Jackson Chung Peng Kong, Wai Ling Lee, Tat Hin Tan |
2024-09-03 |
$14,017,000 |
| 12033953 |
Electronic device and crosstalk mitigating substrate |
Min Suet Lim, Tin Poay Chuah, Jackson Chung Peng Kong |
2024-07-09 |
$24,938,000 |
| 12002747 |
Integrated bridge for die-to-die interconnects |
Jenny Shio Yin Ong, Seok Ling Lim, Kooi Chi Ooi, Jackson Chung Peng Kong |
2024-06-04 |
$24,500,000 |
| 11955431 |
Interposer structures and methods for 2.5D and 3D packaging |
Jenny Shio Yin Ong, Seok Ling Lim, Jackson Chung Peng Kong, Saravanan Sethuraman |
2024-04-09 |
$27,197,000 |
| 11942412 |
Interposer with flexible portion |
Jackson Chung Peng Kong, Min Suet Lim, Tin Poay Chuah |
2024-03-26 |
$33,708,000 |
| 11887940 |
Integrated circuit packages with conductive element having cavities housing electrically connected embedded components |
Seok Ling Lim, Jenny Shio Yin Ong, Jackson Chung Peng Kong |
2024-01-30 |
$30,721,000 |
| 11887917 |
Encapsulated vertical interconnects for high-speed applications and methods of assembling same |
Jackson Chung Peng Kong, Kooi Chi Ooi, Yang Liang Poh |
2024-01-30 |
$30,721,000 |
| 11837458 |
Substrate with gradiated dielectric for reducing impedance mismatch |
Jackson Chung Peng Kong, Ping Ping Ooi, Kooi Chi Ooi |
2023-12-05 |
$33,749,000 |
| 11798894 |
Devices and methods for signal integrity protection technique |
Jackson Chung Peng Kong, Khang Choong Yong, Kooi Chi Ooi, Min Suet Lim |
2023-10-24 |
$20,059,000 |
| 11758662 |
Three dimensional foldable substrate with vertical side interface |
Tin Poay Chuah, Jackson Chung Peng Kong |
2023-09-12 |
$19,004,000 |
| 11676910 |
Embedded reference layers for semiconductor package substrates |
Seok Ling Lim, Jenny Shio Yin Ong, Jackson Chung Peng Kong, Kooi Chi Ooi |
2023-06-13 |
$22,204,000 |
| 11652026 |
Micro through-silicon via for transistor density scaling |
Choong Kooi Chee, Jackson Chung Peng Kong, Wai Ling Lee, Tat Hin Tan |
2023-05-16 |
$11,130,000 |
| 11639623 |
Micro-hinge for an electronic device |
Howe Yin Loo, Min Suet Lim, Jackson Chung Peng Kong, Poh Tat Oh |
2023-05-02 |
$21,235,000 |
| 11574877 |
Semiconductor miniaturization through component placement on stepped stiffener |
Jenny Shio Yin Ong, Seok Ling Lim, Jackson Chung Peng Kong |
2023-02-07 |
$11,877,000 |
