Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412784 | Recessed vertical interconnects for device miniaturization | Yee Lun Ong, Bok Eng Cheah, Jackson Chung Peng Kong | 2025-09-09 |
| 11805602 | Chip assemblies | Loke Yip Foo, Choong Kooi Chee | 2023-10-31 |
| 11562959 | Embedded dual-sided interconnect bridges for integrated-circuit packages | Loke Yip Foo, Choong Kooi Chee | 2023-01-24 |
| 11527481 | Stacked semiconductor package with flyover bridge | Choong Kooi Chee, Bok Eng Cheah, Jackson Chung Peng Kong, Loke Yip Foo | 2022-12-13 |
| 10084698 | Selectively enabling first and second communication paths using a repeater | Amit Kumar Srivastava | 2018-09-25 |
| 10014710 | Foldable fabric-based packaging solution | Bok Eng Cheah, Jackson Chung Peng Kong, Kooi Chi Ooi, Mark A. Schaecher, Eng Huat Goh | 2018-07-03 |
| 9606955 | Embedded universal serial bus solutions | Huimin Chen, Jia Jun Lee, Amit Kumar Srivastava, Tim McKee | 2017-03-28 |
| 7109569 | Dual referenced microstrip | James Breisch, Chee-Yee Chung, Alex Waizman | 2006-09-19 |
| 6686819 | Dual referenced microstrip | James Breisch, Chee-Yee Chung, Alex Waizman | 2004-02-03 |