Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12237245 | Face-to-face through-silicon via multi-chip semiconductor apparatus with redistribution layer packaging and methods of assembling same | Choong Kooi Chee | 2025-02-25 |
| 12125768 | Face-to-face through-silicon via multi-chip semiconductor apparatus with redistribution layer packaging and methods of assembling same | Choong Kooi Chee | 2024-10-22 |
| 11805602 | Chip assemblies | Choong Kooi Chee, Teong Guan Yew | 2023-10-31 |
| 11562959 | Embedded dual-sided interconnect bridges for integrated-circuit packages | Teong Guan Yew, Choong Kooi Chee | 2023-01-24 |
| 11527481 | Stacked semiconductor package with flyover bridge | Choong Kooi Chee, Bok Eng Cheah, Teong Guan Yew, Jackson Chung Peng Kong | 2022-12-13 |
| 11393758 | Power delivery for embedded interconnect bridge devices and methods | Bok Eng Cheah, Jackson Chung Peng Kong, Wai Ling Lee | 2022-07-19 |
| 11107751 | Face-to-face through-silicon via multi-chip semiconductor apparatus with redistribution layer packaging and methods of assembling same | Choong Kooi Chee | 2021-08-31 |
| 9978735 | Interconnection of an embedded die | Choong Kooi Chee, Mei See Chin, Wai Ling Lee, Wei Lun Oo | 2018-05-22 |
| 9842181 | Method to optimize general-purpose input/output interface pad assignments for integrated circuit | Kyung Suk Oh, Yee Huan Yew, Chee Cheong Tan, Mei See Chin, Wai Ling Lee +2 more | 2017-12-12 |
| 7081772 | Optimizing logic in non-reprogrammable logic devices | — | 2006-07-25 |