Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Interconnection of an embedded die

Interconnection of an embedded die

US Patent 9978735 · Granted May 22, 2018

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Face-to-face through-silicon via multi-chip semiconductor apparatus with redistr2025
Face-to-face through-silicon via multi-chip semiconductor apparatus with redistr2025
Face-to-face through-silicon via multi-chip semiconductor apparatus with redistr2024
Face-to-face through-silicon via multi-chip semiconductor apparatus with redistr2024
Micro through-silicon via for transistor density scaling2024
Micro through-silicon via for transistor density scaling2024
Micro through-silicon via for transistor density scaling2024
Micro through-silicon via for transistor density scaling2024
Chip assemblies2023
Chip assemblies2023
Micro through-silicon via for transistor density scaling2023
Micro through-silicon via for transistor density scaling2023