Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
WL

Wai Ling Lee — 12 Patents

Intel: 9 patents #4,462 of 30,777Top 15%
IBM: 3 patents #26,335 of 70,183Top 40%
Overall (All Time): #396,045 of 4,157,543Top 10%
12 Patents All Time
Wai Ling Lee has been granted 12 US patents while listed as an inventor at Intel. The first was granted in 2000 and the most recent in October 2024. Wai Ling Lee ranks #396,045 of 4,157,543 US inventors in our database (top 9.5%). Patent records list Wai Ling Lee in Bayan Lepas, NY, MY.

Patents per Year

Patents granted per year, 2000 to 2024Bar chart with a peak of 3 patents in 2022.peak 32000: 1 patents20002001: 1 patents20012002: 1 patents20022017: 1 patents20172018: 1 patents20182021: 1 patents20212022: 3 patents20222023: 1 patents20232024: 2 patents2024

Issued Patents All Time

Showing 1–12 of 12 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
12112997 Micro through-silicon via for transistor density scaling Bok Eng Cheah, Choong Kooi Chee, Jackson Chung Peng Kong, Tat Hin Tan 2024-10-08 $19,971,000
12080628 Micro through-silicon via for transistor density scaling Bok Eng Cheah, Choong Kooi Chee, Jackson Chung Peng Kong, Tat Hin Tan 2024-09-03 $14,017,000
11652026 Micro through-silicon via for transistor density scaling Bok Eng Cheah, Choong Kooi Chee, Jackson Chung Peng Kong, Tat Hin Tan 2023-05-16 $11,130,000
11398415 Stacked through-silicon vias for multi-device packages Bok Eng Cheah, Choong Kooi Chee, Jackson Chung Peng Kong, Tat Hin Tan 2022-07-26 $27,041,000
11393741 Micro through-silicon via for transistor density scaling Bok Eng Cheah, Choong Kooi Chee, Jackson Chung Peng Kong, Tat Hin Tan 2022-07-19 $11,394,000
11393758 Power delivery for embedded interconnect bridge devices and methods Bok Eng Cheah, Jackson Chung Peng Kong, Loke Yip Foo 2022-07-19 $11,394,000
10903142 Micro through-silicon via for transistor density scaling Bok Eng Cheah, Choong Kooi Chee, Jackson Chung Peng Kong, Tat Hin Tan 2021-01-26 $50,999,000
9978735 Interconnection of an embedded die Loke Yip Foo, Choong Kooi Chee, Mei See Chin, Wei Lun Oo 2018-05-22
9842181 Method to optimize general-purpose input/output interface pad assignments for integrated circuit Kyung Suk Oh, Yee Huan Yew, Chee Cheong Tan, Mei See Chin, Loke Yip Foo +2 more 2017-12-12
6442634 System and method for interrupt command queuing and ordering Timothy C. Bronson, Vincent P. Zeyak, Jr. 2002-08-27 $8,564,000
6279064 System and method for loading commands to a bus, directly loading selective commands while queuing and strictly ordering other commands Timothy C. Bronson, Vincent P. Zeyak, Jr. 2001-08-21 $21,309,000
6065088 System and method for interrupt command queuing and ordering Timothy C. Bronson, Vincent P. Zeyak, Jr. 2000-05-16 $24,852,000