Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Micro through-silicon via for transistor density scaling

Micro through-silicon via for transistor density scaling

US Patent 11393741 · Granted Jul 19, 2022

Estimated economic value: $11,394,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Vertical interconnect design for improved electrical performance2025
Vertical interconnect design for improved electrical performance2025
Integrated bridge frame for package substrate2025
Integrated bridge frame for package substrate2025
Offset calibration method and apparatus for high bandwidth memory 3 (HBM3)2025
System and a method for aligning a programmable clock or strobe2025
Recessed vertical interconnects for device miniaturization2025
Recessed vertical interconnects for device miniaturization2025
Asymmetrical laminated circuit boards for improved electrical performance2025
Asymmetrical laminated circuit boards for improved electrical performance2025
Semiconductor package with hybrid mold layers2025
Semiconductor package with hybrid mold layers2025