Issued Patents All Time
Showing 25 most recent of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12237245 | Face-to-face through-silicon via multi-chip semiconductor apparatus with redistribution layer packaging and methods of assembling same | Loke Yip Foo | 2025-02-25 |
| 12125768 | Face-to-face through-silicon via multi-chip semiconductor apparatus with redistribution layer packaging and methods of assembling same | Loke Yip Foo | 2024-10-22 |
| 12112997 | Micro through-silicon via for transistor density scaling | Bok Eng Cheah, Jackson Chung Peng Kong, Wai Ling Lee, Tat Hin Tan | 2024-10-08 |
| 12080628 | Micro through-silicon via for transistor density scaling | Bok Eng Cheah, Jackson Chung Peng Kong, Wai Ling Lee, Tat Hin Tan | 2024-09-03 |
| 11805602 | Chip assemblies | Loke Yip Foo, Teong Guan Yew | 2023-10-31 |
| 11652026 | Micro through-silicon via for transistor density scaling | Bok Eng Cheah, Jackson Chung Peng Kong, Wai Ling Lee, Tat Hin Tan | 2023-05-16 |
| 11562959 | Embedded dual-sided interconnect bridges for integrated-circuit packages | Loke Yip Foo, Teong Guan Yew | 2023-01-24 |
| 11527481 | Stacked semiconductor package with flyover bridge | Bok Eng Cheah, Teong Guan Yew, Jackson Chung Peng Kong, Loke Yip Foo | 2022-12-13 |
| 11398415 | Stacked through-silicon vias for multi-device packages | Bok Eng Cheah, Jackson Chung Peng Kong, Tat Hin Tan, Wai Ling Lee | 2022-07-26 |
| 11393741 | Micro through-silicon via for transistor density scaling | Bok Eng Cheah, Jackson Chung Peng Kong, Wai Ling Lee, Tat Hin Tan | 2022-07-19 |
| 11107751 | Face-to-face through-silicon via multi-chip semiconductor apparatus with redistribution layer packaging and methods of assembling same | Loke Yip Foo | 2021-08-31 |
| 10903142 | Micro through-silicon via for transistor density scaling | Bok Eng Cheah, Jackson Chung Peng Kong, Tat Hin Tan, Wai Ling Lee | 2021-01-26 |
| 10136516 | Microelectronic device attachment on a reverse microelectronic package | Howe Yin Loo | 2018-11-20 |
| 9978735 | Interconnection of an embedded die | Loke Yip Foo, Mei See Chin, Wai Ling Lee, Wei Lun Oo | 2018-05-22 |
| 9699904 | Microelectronic device attachment on a reverse microelectronic package | Howe Yin Loo | 2017-07-04 |
| 9159714 | Package on wide I/O silicon | Jenny Shio Yin Ong, Seok Ling Lim | 2015-10-13 |
| 8835220 | Backside mold process for ultra thin substrate and package on package assembly | Huay Huay Sim, Kein Fee Liew | 2014-09-16 |
| 8384223 | Backside mold process for ultra thin substrate and package on package assembly | Huay Huay Sim, Kein Fee Liew | 2013-02-26 |
| 7453622 | Micro-electromechanical system (mems) polyelectrolyte gel network pump | — | 2008-11-18 |
| 7339276 | Underfilling process in a molded matrix array package using flow front modifying solder resist | Rahul N. Manepalli, Saravanan Krishnan | 2008-03-04 |
| 7262077 | Capillary underfill and mold encapsulation method and apparatus | Yin Lai, Edward Then, Cheong Ng, Mun Low | 2007-08-28 |
| 7212332 | Micro-electromechanical system (MEMS) polyelectrolyte gel network pump | — | 2007-05-01 |
| 7151014 | Underfilling process in a molded matrix array package using flow front modifying solder resist | Rahul N. Manepalli, Saravanan Krishnan | 2006-12-19 |
| 7088010 | Chip packaging compositions, packages and systems made therewith, and methods of making same | Sheau Hooi Lim | 2006-08-08 |
| 7005321 | Stress-compensation layers in contact arrays, and processes of making same | — | 2006-02-28 |