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Stress-relief layers and stress-compensation collars with low-temperature solders for board-level joints, and processes of making same |
Daewoong Suh, Saikumar Jayaraman, Stephen Lehman, Mitesh Patel, Tiffany Byrne +4 more |
2007-11-06 |
| 7253088 |
Stress-relief layers and stress-compensation collars with low-temperature solders for board-level joints, and processes of making same |
Daewoong Suh, Saikumar Jayaraman, Stephen Lehman, Mitesh Patel, Tiffany Byrne +4 more |
2007-08-07 |
| 7244634 |
Stress-relief layer and stress-compensation collar in contact arrays, and processes of making same |
Daewoong Suh, Saikumar Jayaraman, Mohd Erwan P. Bin Basiron, Yoong Tatt Chin |
2007-07-17 |
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Chip packaging compositions, packages and systems made therewith, and methods of making same |
Choong Kooi Chee |
2006-08-08 |