Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11264301 | System and method to enhance reliability in connection with arrangements including circuits | Lee Kong Yu, Sungjun Im, Chun Sean Lau, Paramjeet Singh Gill, Weng Hong Teh | 2022-03-01 |
| 11094604 | System and method to enhance solder joint reliability | Lee Kong Yu, Sungjun Im, Chun Sean Lau, Paramjeet Singh Gill, Weng Hong Teh | 2021-08-17 |
| 10636722 | System and method to enhance solder joint reliability | Lee Kong Yu, Sungjun Im, Chun Sean Lau, Paramjeet Singh Gill, Weng Hong Teh | 2020-04-28 |
| 7291548 | Stress-relief layers and stress-compensation collars with low-temperature solders for board-level joints, and processes of making same | Daewoong Suh, Saikumar Jayaraman, Stephen Lehman, Mitesh Patel, Tiffany Byrne +4 more | 2007-11-06 |
| 7253088 | Stress-relief layers and stress-compensation collars with low-temperature solders for board-level joints, and processes of making same | Daewoong Suh, Saikumar Jayaraman, Stephen Lehman, Mitesh Patel, Tiffany Byrne +4 more | 2007-08-07 |
| 7244634 | Stress-relief layer and stress-compensation collar in contact arrays, and processes of making same | Daewoong Suh, Saikumar Jayaraman, Mohd Erwan P. Bin Basiron, Sheau Hooi Lim | 2007-07-17 |