Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12324102 | Semiconductor storage device including staggered semiconductor memory devices on opposed surfaces | Fu Xing Chan, Bo Yang | 2025-06-03 |
| 12016111 | Protective enclosure for an electronic device | Ahmad Faridzul Hilmi Shamsuddin, Bo Yang, Shankara Venkatraman Gopalan, Warren Middlekauff, Ning Ye | 2024-06-18 |
| 11551991 | Semiconductor device package having cover portion with curved surface profile | Bo Yang, Ning Ye, Shrikar Bhagath | 2023-01-10 |
| 11284502 | Thermal relief for through-hole and surface mounting | Choon Kuai Lee, Ing Chyuan Ooi | 2022-03-22 |
| 11264301 | System and method to enhance reliability in connection with arrangements including circuits | Lee Kong Yu, Sungjun Im, Yoong Tatt Chin, Paramjeet Singh Gill, Weng Hong Teh | 2022-03-01 |
| 11094604 | System and method to enhance solder joint reliability | Lee Kong Yu, Sungjun Im, Yoong Tatt Chin, Paramjeet Singh Gill, Weng Hong Teh | 2021-08-17 |
| 10636722 | System and method to enhance solder joint reliability | Lee Kong Yu, Sungjun Im, Yoong Tatt Chin, Paramjeet Singh Gill, Weng Hong Teh | 2020-04-28 |