Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11264301 | System and method to enhance reliability in connection with arrangements including circuits | Sungjun Im, Chun Sean Lau, Yoong Tatt Chin, Paramjeet Singh Gill, Weng Hong Teh | 2022-03-01 |
| 11094604 | System and method to enhance solder joint reliability | Sungjun Im, Chun Sean Lau, Yoong Tatt Chin, Paramjeet Singh Gill, Weng Hong Teh | 2021-08-17 |
| 10636722 | System and method to enhance solder joint reliability | Sungjun Im, Chun Sean Lau, Yoong Tatt Chin, Paramjeet Singh Gill, Weng Hong Teh | 2020-04-28 |