Issued Patents All Time
Showing 25 most recent of 46 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12327807 | High density substrate routing in package | Chia-Pin Chiu | 2025-06-10 |
| 12051667 | High density substrate routing in package | Chia-Pin Chiu | 2024-07-30 |
| 11810884 | High density substrate routing in package | Chia-Pin Chiu | 2023-11-07 |
| 11264301 | System and method to enhance reliability in connection with arrangements including circuits | Lee Kong Yu, Sungjun Im, Chun Sean Lau, Yoong Tatt Chin, Paramjeet Singh Gill | 2022-03-01 |
| 11251150 | High density substrate routing in package | Chia-Pin Chiu | 2022-02-15 |
| 11201128 | Packaged semiconductor die with bumpless die-package interface for bumpless build-up layer (BBUL) packages | Pramod Malatkar, John S. Guzek, Robert L. Sankman | 2021-12-14 |
| 11094604 | System and method to enhance solder joint reliability | Lee Kong Yu, Sungjun Im, Chun Sean Lau, Yoong Tatt Chin, Paramjeet Singh Gill | 2021-08-17 |
| 10861815 | High density substrate routing in package | Chia-Pin Chiu | 2020-12-08 |
| 10636722 | System and method to enhance solder joint reliability | Lee Kong Yu, Sungjun Im, Chun Sean Lau, Yoong Tatt Chin, Paramjeet Singh Gill | 2020-04-28 |
| 10636769 | Semiconductor package having spacer layer | John S. Guzek, Shan Zhong | 2020-04-28 |
| 10508961 | Semiconductor package with air pressure sensor | Kevin Lin, Qing Ma, Feras Eid, Johanna M. Swan | 2019-12-17 |
| 10438915 | High density substrate routing in package | Chia-Pin Chiu | 2019-10-08 |
| 10199346 | High density substrate routing in package | Chia-Pin Chiu | 2019-02-05 |
| 10179729 | Hermetic encapsulation for microelectromechanical systems (MEMS) devices | Sarah Haney, Feras Eid, Sasha N. Oster | 2019-01-15 |
| 10156583 | Method of making an accelerometer | Qing Ma, Valluri Rao, Feras Eid, Kevin Lin, Johanna M. Swan +1 more | 2018-12-18 |
| 10083936 | Semiconductor package having spacer layer | John S. Guzek, Shan Zhong | 2018-09-25 |
| 9929119 | High density substrate routing in BBUL package | Chia-Pin Chiu | 2018-03-27 |
| 9800015 | Optical interconnect on bumpless build-up layer package | Feras Eid, Johanna M. Swan | 2017-10-24 |
| 9748177 | Embedded structures for package-on-package architecture | Vinodhkumar Raghunathan | 2017-08-29 |
| 9708178 | Integration of laminate MEMS in BBUL coreless package | Robert L. Sankman | 2017-07-18 |
| 9686870 | Method of forming a microelectronic device package | John S. Guzek | 2017-06-20 |
| 9674945 | Heterogeneous integration of microfluidic devices in package structures | Kevin Lin, Feras Eid, Qing Ma | 2017-06-06 |
| 9601421 | BBUL material integration in-plane with embedded die for warpage control | Deepak Kulkarni | 2017-03-21 |
| 9576909 | Bumpless die-package interface for bumpless build-up layer (BBUL) | John S. Guzek, Robert L. Sankman | 2017-02-21 |
| 9520376 | Bumpless build-up layer package including an integrated heat spreader | Deepak Kulkarni, Chia-Pin Chiu, Tannaz Harirchian, John S. Guzek | 2016-12-13 |