Issued Patents All Time
Showing 26–46 of 46 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9520350 | Bumpless build-up layer (BBUL) semiconductor package with ultra-thin dielectric layer | Emile Davies-Venn, Ebrahim Andideh, Digvijay A. Raorane, Daniel N. Sobieski | 2016-12-13 |
| 9505610 | Device, system and method for providing MEMS structures of a semiconductor package | Tarek A. Ibrahim, Sarah Haney, Daniel N. Sobieski, Parshuram Balkrishna Zantye, Chad Eric Mair +1 more | 2016-11-29 |
| 9490196 | Multi die package having a die and a spacer layer in a recess | John S. Guzek, Shan Zhong | 2016-11-08 |
| 9437569 | High density substrate routing in BBUL package | Chia-Pin Chiu | 2016-09-06 |
| 9429427 | Inductive inertial sensor architecture and fabrication in packaging build-up layers | Qing Ma, Feras Eid, Kevin Lin, Johanna M. Swan, Valluri Rao | 2016-08-30 |
| 9368401 | Embedded structures for package-on-package architecture | Vinodhkumar Raghunathan | 2016-06-14 |
| 9345184 | Magnetic field shielding for packaging build-up architectures | Sasha N. Oster, Sarah Haney, Feras Eid | 2016-05-17 |
| 9299660 | Controlled solder-on-die integrations on packages and methods of assembling same | Shan Zhong | 2016-03-29 |
| 9297824 | Techniques, systems and devices related to acceleration measurement | Qing Ma, Valluri Rao, Feras Eid, Kevin Lin, Johanna M. Swan +1 more | 2016-03-29 |
| 9275969 | Optical interconnect on bumpless build-up layer package | Feras Eid, Johanna M. Swan | 2016-03-01 |
| 9242854 | Hermetic encapsulation for microelectromechanical systems (MEMS) devices | Sarah Haney, Feras Eid, Sasha N. Oster | 2016-01-26 |
| 9224674 | Packaged semiconductor die with bumpless die-package interface for bumpless build-up layer (BBUL) packages | Pramod Malatkar, John S. Guzek, Robert L. Sankman | 2015-12-29 |
| 9200973 | Semiconductor package with air pressure sensor | Kevin Lin, Qing Ma, Feras Eid, Johanna M. Swan | 2015-12-01 |
| 9190380 | High density substrate routing in BBUL package | Chia-Pin Chiu | 2015-11-17 |
| 9171816 | High density substrate routing in BBUL package | Chia-Pin Chiu | 2015-10-27 |
| 9162867 | Through-silicon via resonators in chip packages and methods of assembling same | Robert Sankman | 2015-10-20 |
| 9153552 | Bumpless build-up layer package including an integrated heat spreader | Deepak Kulkarni, Chia-Pin Chiu, Tannaz Harirchian, John S. Guzek | 2015-10-06 |
| 8937382 | Secondary device integration into coreless microelectronic device packages | John S. Guzek | 2015-01-20 |
| 8912670 | Bumpless build-up layer package including an integrated heat spreader | Deepak Kulkarni, Chia-Pin Chiu, Tannaz Harirchian, John S. Guzek | 2014-12-16 |
| 8866287 | Embedded structures for package-on-package architecture | Vinodhkumar Raghunathan | 2014-10-21 |
| 8633551 | Semiconductor package with mechanical fuse | Kevin Lin, Feras Eid, Qing Ma | 2014-01-21 |