Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11769753 | Thermally-optimized tunable stack in cavity package-on-package | George Vakanas, Aastha Uppal, Shereen ELHALAWATY, Aaron McCann, Edvin Cetegen +1 more | 2023-09-26 |
| 11469185 | Standoff members for semiconductor package | Je-Young Chang, Shubhada H. Sahasrabudhe | 2022-10-11 |
| 10424559 | Thermal management of molded packages | Feras Eid, Nader N. Abazarnia, Johanna M. Swan, Taesha D. Beasley, Sasha N. Oster +1 more | 2019-09-24 |
| 9520376 | Bumpless build-up layer package including an integrated heat spreader | Weng Hong Teh, Deepak Kulkarni, Chia-Pin Chiu, John S. Guzek | 2016-12-13 |
| 9153552 | Bumpless build-up layer package including an integrated heat spreader | Weng Hong Teh, Deepak Kulkarni, Chia-Pin Chiu, John S. Guzek | 2015-10-06 |
| 8912670 | Bumpless build-up layer package including an integrated heat spreader | Weng Hong Teh, Deepak Kulkarni, Chia-Pin Chiu, John S. Guzek | 2014-12-16 |