Issued Patents All Time
Showing 25 most recent of 46 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12283535 | IC die and heat spreaders with solderable thermal interface structures for multi-chip assemblies including solder array thermal interconnects | Debendra Mallik, Ram Viswanath, Elah Bozorg-Grayeli, Ahmad Al Mohammad | 2025-04-22 |
| 12238892 | Immersion cooling for integrated circuit devices | Raanan Sover, James D. Williams, Bradley H. Smith, Nir Peled, Paul C. GEORGE +9 more | 2025-02-25 |
| 12191220 | Hybrid interposer of glass and silicon to reduce thermal crosstalk | Zhimin Wan, Chandra Mohan Jha, Chia-Pin Chiu | 2025-01-07 |
| 12046536 | Integrated heat spreader with enhanced vapor chamber for multichip packages | James C. Matayabas, Jr., Zhimin Wan, Kyle Arrington | 2024-07-23 |
| 12048123 | Heat dissipation device having shielding/containment extensions | Aastha Uppal, Ravindranath V. Mahajan | 2024-07-23 |
| 11984377 | IC die and heat spreaders with solderable thermal interface structures for assemblies including solder array thermal interconnects | Debendra Mallik, Ram Viswanath, Elah Bozorg-Grayeli, Ahmad Al Mohammad | 2024-05-14 |
| 11935808 | IC die and heat spreaders with solderable thermal interface structures for multi-chip assemblies including solder array thermal interconnects | Debendra Mallik, Ram Viswanath, Elah Bozorg-Grayeli, Ahmad Al Mohammad | 2024-03-19 |
| 11923267 | IC die with solderable thermal interface structures for assemblies including solder array thermal interconnects | Debendra Mallik, Ram Viswanath, Elah Bozorg-Grayeli, Ahmad Al Mohammad | 2024-03-05 |
| 11901262 | Cooling solution including microchannel arrays and methods of forming the same | Nicholas Neal, Zhimin Wan, Shankar Devasenathipathy | 2024-02-13 |
| 11854932 | Package wrap-around heat spreader | Feras Eid, Chandra Mohan Jha | 2023-12-26 |
| 11830783 | Embedded substrate heat sink for bottom side cooling | Aastha Uppal, Divya Mani | 2023-11-28 |
| 11832419 | Full package vapor chamber with IHS | Nicholas Neal, Nicholas S. Haehn, Kyle Arrington, Aaron McCann, Edvin Cetegen +4 more | 2023-11-28 |
| 11804418 | Direct liquid micro jet (DLMJ) structures for addressing thermal performance at limited flow rate conditions | Nicholas Neal, Jae Whan Kim, Ravindranath V. Mahajan | 2023-10-31 |
| 11721607 | Integrated circuit assemblies having metal foam structures | Aastha Uppal | 2023-08-08 |
| 11676883 | Thermoelectric coolers combined with phase-change material in integrated circuit packages | Javed Shaikh, Kelly Lofgreen, Weihua Tang, Aastha Uppal | 2023-06-13 |
| 11670561 | 3D buildup of thermally conductive layers to resolve die height differences | Zhimin Wan, Chandra Mohan Jha, Chia-Pin Chiu, Liwei Wang | 2023-06-06 |
| 11664294 | Phase change materials for electromagnetic interference shielding and heat dissipation in integrated circuit assemblies | Aastha Uppal, Weihua Tang, Minseok Ha | 2023-05-30 |
| 11574851 | Coupled cooling fins in ultra-small systems | Aastha Uppal, Omkar G. Karhade, Ram Viswanath, Weihua Tang, Nitin A. Deshpande +6 more | 2023-02-07 |
| 11508645 | Modular technique for die-level liquid cooling | Chandra Mohan Jha | 2022-11-22 |
| 11495518 | Multi-surface heat sink suitable for multi-chip packages | Shrenik Kothari, Sandeep Ahuja, Susan F. Smith, Jeffory L. Smalley, Francisco Gabriel Lozano Sanchez +5 more | 2022-11-08 |
| 11469185 | Standoff members for semiconductor package | Shubhada H. Sahasrabudhe, Tannaz Harirchian | 2022-10-11 |
| 11456232 | Thermal assemblies for multi-chip packages | Zhimin Wan, Chia-Pin Chiu, Shankar Devasenathipathy, Betsegaw K. Gebrehiwot, Chandra Mohan Jha | 2022-09-27 |
| 11378346 | Two-phase metallic alloys to facilitate thermal energy storage of a system on chip | — | 2022-07-05 |
| 11322456 | Die back side structures for warpage control | Feras Eid, Venkata Suresh R. Guthikonda, Shankar Devasenathipathy, Chandra Mohan Jha, Kyle Yazzie +2 more | 2022-05-03 |
| 11081450 | Radiation shield around a component on a substrate | Dong-Ho Han, Jaejin Lee, Jerrod Peterson, Mark Carbone | 2021-08-03 |