| 12283535 |
IC die and heat spreaders with solderable thermal interface structures for multi-chip assemblies including solder array thermal interconnects |
Debendra Mallik, Ram Viswanath, Elah Bozorg-Grayeli, Ahmad Al Mohammad |
2025-04-22 |
|
| 12238892 |
Immersion cooling for integrated circuit devices |
Raanan Sover, James D. Williams, Bradley H. Smith, Nir Peled, Paul C. GEORGE +9 more |
2025-02-25 |
|
| 12191220 |
Hybrid interposer of glass and silicon to reduce thermal crosstalk |
Zhimin Wan, Chandra Mohan Jha, Chia-Pin Chiu |
2025-01-07 |
|
| 12048123 |
Heat dissipation device having shielding/containment extensions |
Aastha Uppal, Ravindranath V. Mahajan |
2024-07-23 |
$20,446,000 |
| 12046536 |
Integrated heat spreader with enhanced vapor chamber for multichip packages |
James C. Matayabas, Jr., Zhimin Wan, Kyle Arrington |
2024-07-23 |
$20,446,000 |
| 11984377 |
IC die and heat spreaders with solderable thermal interface structures for assemblies including solder array thermal interconnects |
Debendra Mallik, Ram Viswanath, Elah Bozorg-Grayeli, Ahmad Al Mohammad |
2024-05-14 |
$33,809,000 |
| 11935808 |
IC die and heat spreaders with solderable thermal interface structures for multi-chip assemblies including solder array thermal interconnects |
Debendra Mallik, Ram Viswanath, Elah Bozorg-Grayeli, Ahmad Al Mohammad |
2024-03-19 |
$28,784,000 |
| 11923267 |
IC die with solderable thermal interface structures for assemblies including solder array thermal interconnects |
Debendra Mallik, Ram Viswanath, Elah Bozorg-Grayeli, Ahmad Al Mohammad |
2024-03-05 |
$29,696,000 |
| 11901262 |
Cooling solution including microchannel arrays and methods of forming the same |
Nicholas Neal, Zhimin Wan, Shankar Devasenathipathy |
2024-02-13 |
$18,546,000 |
| 11854932 |
Package wrap-around heat spreader |
Feras Eid, Chandra Mohan Jha |
2023-12-26 |
$39,948,000 |
| 11832419 |
Full package vapor chamber with IHS |
Nicholas Neal, Nicholas S. Haehn, Kyle Arrington, Aaron McCann, Edvin Cetegen +4 more |
2023-11-28 |
$31,872,000 |
| 11830783 |
Embedded substrate heat sink for bottom side cooling |
Aastha Uppal, Divya Mani |
2023-11-28 |
$31,872,000 |
| 11804418 |
Direct liquid micro jet (DLMJ) structures for addressing thermal performance at limited flow rate conditions |
Nicholas Neal, Jae Whan Kim, Ravindranath V. Mahajan |
2023-10-31 |
$30,374,000 |
| 11721607 |
Integrated circuit assemblies having metal foam structures |
Aastha Uppal |
2023-08-08 |
$22,376,000 |
| 11676883 |
Thermoelectric coolers combined with phase-change material in integrated circuit packages |
Javed Shaikh, Kelly Lofgreen, Weihua Tang, Aastha Uppal |
2023-06-13 |
$22,204,000 |
| 11670561 |
3D buildup of thermally conductive layers to resolve die height differences |
Zhimin Wan, Chandra Mohan Jha, Chia-Pin Chiu, Liwei Wang |
2023-06-06 |
$21,341,000 |
| 11664294 |
Phase change materials for electromagnetic interference shielding and heat dissipation in integrated circuit assemblies |
Aastha Uppal, Weihua Tang, Minseok Ha |
2023-05-30 |
$16,378,000 |
| 11574851 |
Coupled cooling fins in ultra-small systems |
Aastha Uppal, Omkar G. Karhade, Ram Viswanath, Weihua Tang, Nitin A. Deshpande +6 more |
2023-02-07 |
$11,877,000 |
| 11508645 |
Modular technique for die-level liquid cooling |
Chandra Mohan Jha |
2022-11-22 |
$12,862,000 |
| 11495518 |
Multi-surface heat sink suitable for multi-chip packages |
Shrenik Kothari, Sandeep Ahuja, Susan F. Smith, Jeffory L. Smalley, Francisco Gabriel Lozano Sanchez +5 more |
2022-11-08 |
$15,080,000 |
| 11469185 |
Standoff members for semiconductor package |
Shubhada H. Sahasrabudhe, Tannaz Harirchian |
2022-10-11 |
$16,542,000 |
| 11456232 |
Thermal assemblies for multi-chip packages |
Zhimin Wan, Chia-Pin Chiu, Shankar Devasenathipathy, Betsegaw K. Gebrehiwot, Chandra Mohan Jha |
2022-09-27 |
$23,391,000 |
| 11378346 |
Two-phase metallic alloys to facilitate thermal energy storage of a system on chip |
— |
2022-07-05 |
$18,093,000 |
| 11322456 |
Die back side structures for warpage control |
Feras Eid, Venkata Suresh R. Guthikonda, Shankar Devasenathipathy, Chandra Mohan Jha, Kyle Yazzie +2 more |
2022-05-03 |
$16,346,000 |
| 11081450 |
Radiation shield around a component on a substrate |
Dong-Ho Han, Jaejin Lee, Jerrod Peterson, Mark Carbone |
2021-08-03 |
$25,424,000 |
