Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11830783 | Embedded substrate heat sink for bottom side cooling | Aastha Uppal, Je-Young Chang | 2023-11-28 | $31,872,000 |
| 11640929 | Thermal management solutions for cored substrates | Nicholas Neal, Nicholas S. Haehn | 2023-05-02 | $21,235,000 |
| 11581240 | Liquid thermal interface material in electronic packaging | Kedar Dhane, Omkar G. Karhade, Aravindha R. Antoniswamy | 2023-02-14 | $12,790,000 |
| 11112841 | 5G mmWave cooling through PCB | William J. Lambert, Shawna M. Liff, Sergio Antonio Chan Arguedas, Robert L. Sankman | 2021-09-07 | $31,495,000 |