Patents per Year
Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11581240 | Liquid thermal interface material in electronic packaging | Omkar G. Karhade, Aravindha R. Antoniswamy, Divya Mani | 2023-02-14 | $12,790,000 |
| 10461003 | Electronic package that includes multiple supports | Omkar G. Karhade | 2019-10-29 | $25,165,000 |
| 10290561 | Thermal interfaces for integrated circuit packages | Edvin Cetegen, Omkar G. Karhade, Chandra Mohan Jha | 2019-05-14 | $24,469,000 |
| 10157860 | Component stiffener architectures for microelectronic package structures | Omkar G. Karhade, Yongki Min, William J. Lambert | 2018-12-18 | $25,622,000 |
| 9799610 | Plurality of stiffeners with thickness variation | Mingjie Xu, Suzana Prstic | 2017-10-24 | $10,797,000 |