Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11923268 | Printed heat spreader structures and methods of providing same | Jesus Gerardo Reyes Schuldes, Shankar Devasenathipathy, Pramod Malatkar, Kyle Arrington | 2024-03-05 |
| 11894282 | Vented lids for integrated circuit packages | Zhimin Wan, Sergio Antonio Chan Arguedas, Peng Li, Chandra Mohan Jha, Cheng Xu +2 more | 2024-02-06 |
| 11881438 | First-level integration of second-level thermal interface material for integrated circuit assemblies | Elah Bozorg-Grayeli, Kyle Arrington, Sergio Antonio Chan Arguedas | 2024-01-23 |
| 11869824 | Thermal interface structures for integrated circuit packages | Kyle Arrington, Aaron McCann, Kelly Lofgreen, Elah Bozorg-Grayeli, Joseph B. Petrini | 2024-01-09 |
| 11581240 | Liquid thermal interface material in electronic packaging | Kedar Dhane, Omkar G. Karhade, Divya Mani | 2023-02-14 |
| 11004768 | Multi-chip package with partial integrated heat spreader | Muhammad Saiful Islam, Enisa Harris, Suzana Prstic, Sergio Antonio Chan Arguedas, Sachin Deshmukh +1 more | 2021-05-11 |
| 10969840 | Heat spreaders with interlocked inserts | Syadwad Jain, Zhizhong Tang, Wei Hu | 2021-04-06 |
| 10763188 | Integrated heat spreader having electromagnetically-formed features | Thomas J. Fitzgerald, Kumaran Murugesan Chakravarthy, Syadwad Jain, Wei Hu, Zhizhong Tang | 2020-09-01 |
| 10236233 | Heat spreaders with integrated preforms | Thomas J. Fitzgerald | 2019-03-19 |
| 9799584 | Heat spreaders with integrated preforms | Thomas J. Fitzgerald | 2017-10-24 |
| 9515003 | Embedded air core inductors for integrated circuit package substrates with thermal conductor | Thomas J. Fitzgerald, William J. Lambert, Shrenik Kothari, Punita Sullhan | 2016-12-06 |
| 9330999 | Multi-component integrated heat spreader for multi-chip packages | Thomas J. Fitzgerald, Carl Deppisch, Nikunj P. Patel | 2016-05-03 |