Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12392818 | Enhanced jet impingement leak prevention for integrated circuit | Ruben Nunez Blanco, Christopher Wade Ackerman, Paul Diglio, Varun Narayan, Craig Yost +3 more | 2025-08-19 |
| 12366713 | Heat dissipation structures for optical communication devices | Omkar G. Karhade, Tolga Acikalin, Sushrutha Gujjula, Ravindranath V. Mahajan, Chia-Pin Chiu | 2025-07-22 |
| 12238892 | Immersion cooling for integrated circuit devices | Raanan Sover, James D. Williams, Bradley H. Smith, Nir Peled, Paul C. GEORGE +9 more | 2025-02-25 |
| 11869824 | Thermal interface structures for integrated circuit packages | Kyle Arrington, Aaron McCann, Elah Bozorg-Grayeli, Aravindha R. Antoniswamy, Joseph B. Petrini | 2024-01-09 |
| 11798861 | Integrated heat spreader (IHS) with heating element | Peng Li, Manish Dubey, Bamidele Daniel Falola, Ken Hackenberg, Shenavia S. Howell +3 more | 2023-10-24 |
| 11756856 | Package architecture including thermoelectric cooler structures | Krishna Vasanth Valavala, Ravindranath V. Mahajan, Chandra Mohan Jha, Weihua Tang | 2023-09-12 |
| 11694942 | Annular silicon-embedded thermoelectric cooling devices for localized on-die thermal management | Chandra Mohan Jha, Krishna Vasanth Valavala | 2023-07-04 |
| 11676883 | Thermoelectric coolers combined with phase-change material in integrated circuit packages | Javed Shaikh, Je-Young Chang, Weihua Tang, Aastha Uppal | 2023-06-13 |
| 11658095 | Bump integrated thermoelectric cooler | Chandra Mohan Jha, Krishna Vasanth Valavala | 2023-05-23 |
| 11551994 | Liquid metal TIM with STIM-like performance with no BSM and BGA compatible | Chia-Pin Chiu, Joseph Petrini, Edvin Cetegen, Betsegaw K. Gebrehiwot, Feras Eid | 2023-01-10 |
| 11464139 | Conformable heat sink interface with a high thermal conductivity | Joseph B. Petrini, Todd Coons, Christopher Wade Ackerman, Edvin Cetegen, Yang Jiao +2 more | 2022-10-04 |
| 11462457 | Using a thermoelectric cooler to reduce heat transfer between heat-conducting plates | Krishna Vasanth Valavala, Chandra Mohan Jha | 2022-10-04 |
| 10651108 | Foam composite | Zhizhong Tang, Syadwad Jain, Wei Hu, Michael A. Schroeder, Rajen S. Sidhu +3 more | 2020-05-12 |
| 10461011 | Microelectronics package with an integrated heat spreader having indentations | Nicholas Neal, David W. Mendel, Chandra Mohan Jha | 2019-10-29 |
| 9418912 | Methods of forming serpentine thermal interface material and structures formed thereby | Patrick Nardi | 2016-08-16 |
| 9230877 | Methods of forming serpentine thermal interface material and structures formed thereby | Patrick Nardi | 2016-01-05 |