| 12183688 |
Integrated circuit die package stiffeners of metal alloys having exceptionally high CTE |
Valery Ouvarov-Bancalero, John Harper, Malavarayan Sankarasubramanian, Bamidele Daniel Falola, Ravi Siddappa +1 more |
2024-12-31 |
| 10651108 |
Foam composite |
Zhizhong Tang, Syadwad Jain, Wei Hu, Michael A. Schroeder, Rajen S. Sidhu +3 more |
2020-05-12 |
| 10535615 |
Electronic package that includes multi-layer stiffener |
Manish Dubey, Srikant Nekkanty, Rajendra C. Dias |
2020-01-14 |
| 10290569 |
Constrained cure component attach process for improved IC package warpage control |
Kyle Yazzie, Venkata Suresh R. Guthikonda, Santosh Sankarasubramanian, Kevin Y. Lin, Leigh M. TRIBOLET +2 more |
2019-05-14 |
| 9887104 |
Electronic package and method of connecting a first die to a second die to form an electronic package |
Manish Dubey, Rajendra C. Dias, David Woodhams |
2018-02-06 |
| 9832860 |
Panel level fabrication of package substrates with integrated stiffeners |
Robert Starkston, John S. Guzek, Keith Jones, Javier Soto Gonzalez |
2017-11-28 |
| 9418912 |
Methods of forming serpentine thermal interface material and structures formed thereby |
Kelly Lofgreen |
2016-08-16 |
| 9230877 |
Methods of forming serpentine thermal interface material and structures formed thereby |
Kelly Lofgreen |
2016-01-05 |