Patrick Nardi — 9 Patents at Intel

Patrick Nardi has been granted 9 US patents while listed as an inventor at Intel. The first was granted in 2016 and the most recent in December 2025. Patrick Nardi ranks #535,341 of 4,157,543 US inventors in our database (top 12.9%). Patent records list Patrick Nardi in Scottsdale, AZ, US.

Issued Patents All Time

Showing 1–9 of 9 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
12494441	BGA stiffener attachment with low Eolife adhesive strength at high solder joint stress area generated from enabling load	Phil Geng, Ravindranath V. Mahajan, Dingying Xu, Praveen Raghavan, John Harper +2 more	2025-12-09
12183688	Integrated circuit die package stiffeners of metal alloys having exceptionally high CTE	Valery Ouvarov-Bancalero, John Harper, Malavarayan Sankarasubramanian, Bamidele Daniel Falola, Ravi Siddappa +1 more	2024-12-31	$16,542,000
10651108	Foam composite	Zhizhong Tang, Syadwad Jain, Wei Hu, Michael A. Schroeder, Rajen S. Sidhu +3 more	2020-05-12	$29,489,000
10535615	Electronic package that includes multi-layer stiffener	Manish Dubey, Srikant Nekkanty, Rajendra C. Dias	2020-01-14	$30,813,000
10290569	Constrained cure component attach process for improved IC package warpage control	Kyle Yazzie, Venkata Suresh R. Guthikonda, Santosh Sankarasubramanian, Kevin Y. Lin, Leigh M. TRIBOLET +2 more	2019-05-14	$24,469,000
9887104	Electronic package and method of connecting a first die to a second die to form an electronic package	Manish Dubey, Rajendra C. Dias, David Woodhams	2018-02-06	$17,987,000
9832860	Panel level fabrication of package substrates with integrated stiffeners	Robert Starkston, John S. Guzek, Keith Jones, Javier Soto Gonzalez	2017-11-28	$12,678,000
9418912	Methods of forming serpentine thermal interface material and structures formed thereby	Kelly Lofgreen	2016-08-16	$10,311,000
9230877	Methods of forming serpentine thermal interface material and structures formed thereby	Kelly Lofgreen	2016-01-05	$11,513,000

Patrick Nardi — 9 Patents

Issued Patents All Time

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