Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12142568 | Multi-die ultrafine pitch patch architecture of interconnect bridge over glass layer and method of making | Sanka Ganesan, Kevin Thomas McCarthy, Debendra Mallik, Ravindranath V. Mahajan, Robert L. Sankman | 2024-11-12 |
| 11756889 | Ultrathin bridge and multi-die ultrafine pitch patch architecture and method of making | Sanka Ganesan, Kevin Thomas McCarthy, Debendra Mallik, Ravindranath V. Mahajan, Robert L. Sankman | 2023-09-12 |
| 11694959 | Multi-die ultrafine pitch patch architecture and method of making | Sanka Ganesan, Kevin Thomas McCarthy, Debendra Mallik, Ravindranath V. Mahajan, Robert L. Sankman | 2023-07-04 |
| 10290569 | Constrained cure component attach process for improved IC package warpage control | Kyle Yazzie, Venkata Suresh R. Guthikonda, Patrick Nardi, Santosh Sankarasubramanian, Kevin Y. Lin +2 more | 2019-05-14 |