| 12476174 |
Ultra-thin, hyper-density semiconductor packages |
Debendra Mallik, Robert L. Sankman, Robert M. Nickerson, Mitul Modi, Rajasekaran Swaminathan +4 more |
2025-11-18 |
|
| 12406914 |
Ultra-thin, hyper-density semiconductor packages |
Debendra Mallik, Robert L. Sankman, Robert M. Nickerson, Mitul Modi, Rajasekaran Swaminathan +4 more |
2025-09-02 |
|
| 12387999 |
Planar integrated circuit package interconnects |
Robert L. Sankman |
2025-08-12 |
|
| 12368089 |
Low cost embedded integrated circuit dies |
Xavier Francois Brun |
2025-07-22 |
|
| 12347782 |
Microelectronic assemblies with direct attach to circuit boards |
William J. Lambert, Bharat P. Penmecha, Xavier Francois Brun |
2025-07-01 |
|
| 12334242 |
Coreless electronic substrates having embedded inductors |
Sri Chaitra Jyotsna Chavali, Robert L. Sankman, Anne Augustine, Kaladhar Radhakrishnan |
2025-06-17 |
|
| 12261124 |
Embedded die architecture and method of making |
Robert L. Sankman, Sri Chaitra Jyotsna Chavali |
2025-03-25 |
|
| 12176292 |
Microelectronic component having molded regions with through-mold vias |
Ram Viswanath, Xavier Francois Brun, Tarek A. Ibrahim, Jason M. Gamba, Manish Dubey +1 more |
2024-12-24 |
$17,261,000 |
| 12170273 |
Integrated circuit assemblies with direct chip attach to circuit boards |
Wilfred Gomes, Abhishek A. Sharma, Doug B. Ingerly, Mauro J. Kobrinsky, Kevin J. Fischer |
2024-12-17 |
$33,648,000 |
| 12142568 |
Multi-die ultrafine pitch patch architecture of interconnect bridge over glass layer and method of making |
Kevin Thomas McCarthy, Leigh M. TRIBOLET, Debendra Mallik, Ravindranath V. Mahajan, Robert L. Sankman |
2024-11-12 |
$28,491,000 |
| 11978727 |
Package on active silicon semiconductor packages |
Wilfred Gomes, Doug B. Ingerly, Robert L. Sankman, Mark Bohr, Debendra Mallik |
2024-05-07 |
$26,756,000 |
| 11869842 |
Scalable high speed high bandwidth IO signaling package architecture and method of making |
Robert L. Sankman, Arghya Sain, Sri Chaitra Jyotsna Chavali, Lijiang Wang, Cemil Geyik |
2024-01-09 |
$30,329,000 |
| 11817390 |
Microelectronic component having molded regions with through-mold vias |
Ram Viswanath, Xavier Francois Brun, Tarek A. Ibrahim, Jason M. Gamba, Manish Dubey +1 more |
2023-11-14 |
$31,444,000 |
| 11804426 |
Integrated circuit structures in package substrates |
William J. Lambert, Zhichao Zhang, Sri Chaitra Jyotsna Chavali, Stephen Andrew Smith, Michael J. Hill +1 more |
2023-10-31 |
$30,374,000 |
| 11756889 |
Ultrathin bridge and multi-die ultrafine pitch patch architecture and method of making |
Kevin Thomas McCarthy, Leigh M. TRIBOLET, Debendra Mallik, Ravindranath V. Mahajan, Robert L. Sankman |
2023-09-12 |
$19,004,000 |
| 11694959 |
Multi-die ultrafine pitch patch architecture and method of making |
Kevin Thomas McCarthy, Leigh M. TRIBOLET, Debendra Mallik, Ravindranath V. Mahajan, Robert L. Sankman |
2023-07-04 |
|
| 11640942 |
Microelectronic component having molded regions with through-mold vias |
Ram Viswanath, Xavier Francois Brun, Tarek A. Ibrahim, Jason M. Gamba, Manish Dubey +1 more |
2023-05-02 |
$21,235,000 |
| 11581287 |
Chip scale thin 3D die stacked package |
Robert L. Sankman, Bernd Waidhas, Thomas Wagner, Lizabeth Keser |
2023-02-14 |
$12,790,000 |
| 11574851 |
Coupled cooling fins in ultra-small systems |
Aastha Uppal, Omkar G. Karhade, Ram Viswanath, Je-Young Chang, Weihua Tang +6 more |
2023-02-07 |
$11,877,000 |
| 11552035 |
Electronic package with stud bump electrical connections |
Zhaozhi Li, Debendra Mallik, Gregory Perry, Kuan-Hsun Lu, Omkar G. Karhade +1 more |
2023-01-10 |
$14,061,000 |
| 11545441 |
Semiconductor package having wafer-level active die and external die mount |
Vipul V. Mehta, Eric J. Li, Debendra Mallik, Robert L. Sankman |
2023-01-03 |
$15,575,000 |
| 11545407 |
Thermal management solutions for integrated circuit packages |
Kumar Abhishek Singh, Omkar G. Karhade, Nitin A. Deshpande, Mitul Modi, Edvin Cetegen +8 more |
2023-01-03 |
$15,575,000 |
| 11430724 |
Ultra-thin, hyper-density semiconductor packages |
Debendra Mallik, Robert L. Sankman, Robert M. Nickerson, Mitul Modi, Rajasekaran Swaminathan +4 more |
2022-08-30 |
$13,077,000 |
| 11410919 |
Stacked silicon die architecture with mixed flipcip and wirebond interconnect |
Robert L. Sankman |
2022-08-09 |
$13,688,000 |
| 11387175 |
Interposer package-on-package (PoP) with solder array thermal contacts |
Debendra Mallik, Pilin Liu, Shawna M. Liff, Sri Chaitra Jyotsna Chavali, Sandeep Gaan +2 more |
2022-07-12 |
$13,106,000 |
