Issued Patents All Time
Showing 25 most recent of 58 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406914 | Ultra-thin, hyper-density semiconductor packages | Debendra Mallik, Robert L. Sankman, Robert M. Nickerson, Mitul Modi, Rajasekaran Swaminathan +4 more | 2025-09-02 |
| 12387999 | Planar integrated circuit package interconnects | Robert L. Sankman | 2025-08-12 |
| 12368089 | Low cost embedded integrated circuit dies | Xavier Francois Brun | 2025-07-22 |
| 12347782 | Microelectronic assemblies with direct attach to circuit boards | William J. Lambert, Bharat P. Penmecha, Xavier Francois Brun | 2025-07-01 |
| 12334242 | Coreless electronic substrates having embedded inductors | Sri Chaitra Jyotsna Chavali, Robert L. Sankman, Anne Augustine, Kaladhar Radhakrishnan | 2025-06-17 |
| 12261124 | Embedded die architecture and method of making | Robert L. Sankman, Sri Chaitra Jyotsna Chavali | 2025-03-25 |
| 12176292 | Microelectronic component having molded regions with through-mold vias | Ram Viswanath, Xavier Francois Brun, Tarek A. Ibrahim, Jason M. Gamba, Manish Dubey +1 more | 2024-12-24 |
| 12170273 | Integrated circuit assemblies with direct chip attach to circuit boards | Wilfred Gomes, Abhishek A. Sharma, Doug B. Ingerly, Mauro J. Kobrinsky, Kevin J. Fischer | 2024-12-17 |
| 12142568 | Multi-die ultrafine pitch patch architecture of interconnect bridge over glass layer and method of making | Kevin Thomas McCarthy, Leigh M. TRIBOLET, Debendra Mallik, Ravindranath V. Mahajan, Robert L. Sankman | 2024-11-12 |
| 11978727 | Package on active silicon semiconductor packages | Wilfred Gomes, Doug B. Ingerly, Robert L. Sankman, Mark Bohr, Debendra Mallik | 2024-05-07 |
| 11869842 | Scalable high speed high bandwidth IO signaling package architecture and method of making | Robert L. Sankman, Arghya Sain, Sri Chaitra Jyotsna Chavali, Lijiang Wang, Cemil Geyik | 2024-01-09 |
| 11817390 | Microelectronic component having molded regions with through-mold vias | Ram Viswanath, Xavier Francois Brun, Tarek A. Ibrahim, Jason M. Gamba, Manish Dubey +1 more | 2023-11-14 |
| 11804426 | Integrated circuit structures in package substrates | William J. Lambert, Zhichao Zhang, Sri Chaitra Jyotsna Chavali, Stephen Andrew Smith, Michael J. Hill +1 more | 2023-10-31 |
| 11756889 | Ultrathin bridge and multi-die ultrafine pitch patch architecture and method of making | Kevin Thomas McCarthy, Leigh M. TRIBOLET, Debendra Mallik, Ravindranath V. Mahajan, Robert L. Sankman | 2023-09-12 |
| 11694959 | Multi-die ultrafine pitch patch architecture and method of making | Kevin Thomas McCarthy, Leigh M. TRIBOLET, Debendra Mallik, Ravindranath V. Mahajan, Robert L. Sankman | 2023-07-04 |
| 11640942 | Microelectronic component having molded regions with through-mold vias | Ram Viswanath, Xavier Francois Brun, Tarek A. Ibrahim, Jason M. Gamba, Manish Dubey +1 more | 2023-05-02 |
| 11581287 | Chip scale thin 3D die stacked package | Robert L. Sankman, Bernd Waidhas, Thomas Wagner, Lizabeth Keser | 2023-02-14 |
| 11574851 | Coupled cooling fins in ultra-small systems | Aastha Uppal, Omkar G. Karhade, Ram Viswanath, Je-Young Chang, Weihua Tang +6 more | 2023-02-07 |
| 11552035 | Electronic package with stud bump electrical connections | Zhaozhi Li, Debendra Mallik, Gregory Perry, Kuan-Hsun Lu, Omkar G. Karhade +1 more | 2023-01-10 |
| 11545441 | Semiconductor package having wafer-level active die and external die mount | Vipul V. Mehta, Eric J. Li, Debendra Mallik, Robert L. Sankman | 2023-01-03 |
| 11545407 | Thermal management solutions for integrated circuit packages | Kumar Abhishek Singh, Omkar G. Karhade, Nitin A. Deshpande, Mitul Modi, Edvin Cetegen +8 more | 2023-01-03 |
| 11430724 | Ultra-thin, hyper-density semiconductor packages | Debendra Mallik, Robert L. Sankman, Robert M. Nickerson, Mitul Modi, Rajasekaran Swaminathan +4 more | 2022-08-30 |
| 11410919 | Stacked silicon die architecture with mixed flipcip and wirebond interconnect | Robert L. Sankman | 2022-08-09 |
| 11387175 | Interposer package-on-package (PoP) with solder array thermal contacts | Debendra Mallik, Pilin Liu, Shawna M. Liff, Sri Chaitra Jyotsna Chavali, Sandeep Gaan +2 more | 2022-07-12 |
| 11302643 | Microelectronic component having molded regions with through-mold vias | Ram Viswanath, Xavier Francois Brun, Tarek A. Ibrahim, Jason M. Gamba, Manish Dubey +1 more | 2022-04-12 |