Issued Patents All Time
Showing 26–50 of 58 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11276630 | Planar integrated circuit package interconnects | Robert L. Sankman | 2022-03-15 |
| 11127706 | Electronic package with stud bump electrical connections | Zhaozhi Li, Debendra Mallik, Gregory Perry, Kuan-Hsun Lu, Omkar G. Karhade +1 more | 2021-09-21 |
| 11107757 | Integrated circuit structures in package substrates | William J. Lambert, Zhichao Zhang, Sri Chaitra Jyotsna Chavali, Stephen Andrew Smith, Michael J. Hill +1 more | 2021-08-31 |
| 10910317 | Semiconductor package having wafer-level active die and external die mount | Vipul V. Mehta, Eric J. Li, Debendra Mallik, Robert L. Sankman | 2021-02-02 |
| 10903166 | Integrated circuit packages | Thorsten Meyer, Gerald Ofner | 2021-01-26 |
| 10784204 | Rlink—die to die channel interconnect configurations to improve signaling | Kemal Aygun, Richard J. Dischler, Jeff C. Morriss, Zhiguo Qian, Wilfred Gomes +7 more | 2020-09-22 |
| 10672693 | Integrated circuit structures in package substrates | William J. Lambert, Zhichao Zhang, Sri Chaitra Jyotsna Chavali, Stephen Andrew Smith, Michael J. Hill +1 more | 2020-06-02 |
| 10658279 | High density package interconnects | Zhiguo Qian, Robert L. Sankman, Krishna Srinivasan, Zhaohui Zhu | 2020-05-19 |
| 10658765 | Edge-firing antenna walls built into substrate | Sri Chaitra Jyotsna Chavali, William J. Lambert, Debendra Mallik, Zhichao Zhang | 2020-05-19 |
| 10651116 | Planar integrated circuit package interconnects | Robert L. Sankman | 2020-05-12 |
| 10580758 | Scalable package architecture and associated techniques and configurations | Bassam M. Ziadeh, Nitesh Nimkar | 2020-03-03 |
| 10396036 | Rlink-ground shielding attachment structures and shadow voiding for data signal contacts of package devices; vertical ground shielding structures and shield fencing of vertical data signal interconnects of package devices; and ground shielding for electro optical module connector data signal contacts and contact pins of package devices | Yu Zhang, Zhiguo Qian, Kemal Aygun, Yidnekachew S. Mekonnen, Gregorio R. Murtagian +2 more | 2019-08-27 |
| 10204851 | High density package interconnects | Zhiguo Qian, Robert L. Sankman, Krishna Srinivasan, Zhaohui Zhu | 2019-02-12 |
| 10170409 | Package on package architecture and method for making | John S. Guzek, Nitesh Nimkar, Klaus Reingruber, Thorsten Meyer | 2019-01-01 |
| 10037976 | Scalable package architecture and associated techniques and configurations | Bassam M. Ziadeh, Nitesh Nimkar | 2018-07-31 |
| 9922916 | High density package interconnects | Zhiguo Qian, Robert L. Sankman, Krishna Srinivasan, Zhaohui Zhu | 2018-03-20 |
| 9832876 | CPU package substrates with removable memory mechanical interfaces | Mani N. Prakash, Thomas T. Holden, Jeffory L. Smalley, Ram Viswanath, Bassam N. Coury +11 more | 2017-11-28 |
| 9793244 | Scalable package architecture and associated techniques and configurations | Bassam M. Ziadeh, Nitesh Nimkar | 2017-10-17 |
| 9721880 | Integrated circuit package structures | Jimin Yao, Shawna M. Liff, Yikang Deng, Debendra Mallik | 2017-08-01 |
| 9660364 | System interconnect for integrated circuits | Timothy Wig, Todd Hinck | 2017-05-23 |
| 9640887 | Low profile zero/low insertion force package top side flex cable connector architecture | Ram Viswanath | 2017-05-02 |
| 9564412 | Shaped and oriented solder joints | Aleksandar Aleksov | 2017-02-07 |
| 9368437 | High density package interconnects | Zhiguo Qian, Robert L. Sankman, Krishna Srinivasan, Zhaohui Zhu | 2016-06-14 |
| 9332643 | Interconnect architecture with stacked flex cable | Timothy Swettlen, Gary Long, Donald T. Tran, Jill D. Murfin, David I. Amir | 2016-05-03 |
| 9324678 | Low profile zero/low insertion force package top side flex cable connector architecture | Ram Viswanath | 2016-04-26 |