Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11552035 | Electronic package with stud bump electrical connections | Sanka Ganesan, Debendra Mallik, Gregory Perry, Kuan-Hsun Lu, Omkar G. Karhade +1 more | 2023-01-10 |
| 11462527 | Micro-trenching mold interface in a pop package | Kumar Abhishek Singh, Thomas J. Debonis, Robert M. Nickerson, Rees WINTERS | 2022-10-04 |
| 11127706 | Electronic package with stud bump electrical connections | Sanka Ganesan, Debendra Mallik, Gregory Perry, Kuan-Hsun Lu, Omkar G. Karhade +1 more | 2021-09-21 |
| 10121722 | Architecture material and process to improve thermal performance of the embedded die package | Chandra Mohan Jha, Eric J. Li, Robert M. Nickerson | 2018-11-06 |
| 9653411 | Electronic package that includes fine powder coating | Donglai Lu, Matthew T. Magnavita, Amram Eitan, Peng-Jen Chen | 2017-05-16 |