Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11574851 | Coupled cooling fins in ultra-small systems | Aastha Uppal, Omkar G. Karhade, Ram Viswanath, Je-Young Chang, Weihua Tang +6 more | 2023-02-07 |
| 11545407 | Thermal management solutions for integrated circuit packages | Omkar G. Karhade, Nitin A. Deshpande, Mitul Modi, Edvin Cetegen, Aastha Uppal +8 more | 2023-01-03 |
| 11462527 | Micro-trenching mold interface in a pop package | Zhaozhi Li, Thomas J. Debonis, Robert M. Nickerson, Rees WINTERS | 2022-10-04 |