Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 12406906 | Through mold interconnect drill feature | Robert M. Nickerson, Purushotham Kaushik Muthur Srinath | 2025-09-02 | |
| 11705383 | Through mold interconnect drill feature | Robert M. Nickerson, Purushotham Kaushik Muthur Srinath | 2023-07-18 | $21,060,000 |
| 11462527 | Micro-trenching mold interface in a pop package | Kumar Abhishek Singh, Zhaozhi Li, Thomas J. Debonis, Robert M. Nickerson | 2022-10-04 | $13,460,000 |