Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11462527 | Micro-trenching mold interface in a pop package | Kumar Abhishek Singh, Zhaozhi Li, Robert M. Nickerson, Rees WINTERS | 2022-10-04 | $13,460,000 |
| 7880124 | Assembly packaging using induction heating | — | 2011-02-01 | $17,150,000 |
| 7265032 | Protective layer during scribing | Sujit Sharan | 2007-09-04 | $18,654,000 |
| 7161122 | Assembly packaging using induction heating | — | 2007-01-09 | $12,865,000 |