Issued Patents All Time
Showing 25 most recent of 41 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417958 | Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and PoP adhesive keep out zone | Elizabeth Nofen, Shripad Gokhale, Nick Ross, Amram Eitan, Nisha Ananthakrishnan +4 more | 2025-09-16 |
| 12406906 | Through mold interconnect drill feature | Rees WINTERS, Purushotham Kaushik Muthur Srinath | 2025-09-02 |
| 12406914 | Ultra-thin, hyper-density semiconductor packages | Debendra Mallik, Robert L. Sankman, Mitul Modi, Sanka Ganesan, Rajasekaran Swaminathan +4 more | 2025-09-02 |
| 12394773 | Laser ablation-based surface property modification and contamination removal | Denis Myasishchev, Andrew V. Mazur, Purushotham Kaushik Muthur Srinath, Shripad Gokhale | 2025-08-19 |
| 12362340 | Laser ablation-based surface property modification and contamination removal | Denis Myasishchev, Andrew V. Mazur, Purushotham Kaushik Muthur Srinath, Shripad Gokhale | 2025-07-15 |
| 12347743 | Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and pop adhesive keep out zone | Elizabeth Nofen, Shripad Gokhale, Nick Ross, Amram Eitan, Nisha Ananthakrishnan +4 more | 2025-07-01 |
| 12315777 | Microelectronics package comprising a package-on-package (POP) architecture with inkjet barrier material for controlling bondline thickness and POP adhesive keep out zone | Elizabeth Nofen, Shripad Gokhale, Nick Ross, Amram Eitan, Nisha Ananthakrishnan +4 more | 2025-05-27 |
| 12107082 | Offset interposers for large-bottom packages and large-die package-on-package structures | Russell K. Mortensen, Nicholas R. Watts | 2024-10-01 |
| 11978730 | Offset interposers for large-bottom packages and large-die package-on-package structures | Russell K. Mortensen, Nicholas R. Watts | 2024-05-07 |
| 11798932 | Offset interposers for large-bottom packages and large-die package-on-package structures | Russell K. Mortensen, Nicholas R. Watts | 2023-10-24 |
| 11705383 | Through mold interconnect drill feature | Rees WINTERS, Purushotham Kaushik Muthur Srinath | 2023-07-18 |
| 11462527 | Micro-trenching mold interface in a pop package | Kumar Abhishek Singh, Zhaozhi Li, Thomas J. Debonis, Rees WINTERS | 2022-10-04 |
| 11430724 | Ultra-thin, hyper-density semiconductor packages | Debendra Mallik, Robert L. Sankman, Mitul Modi, Sanka Ganesan, Rajasekaran Swaminathan +4 more | 2022-08-30 |
| 11222877 | Thermally coupled package-on-package semiconductor packages | Omkar G. Karhade, Robert L. Sankman, Nitin A. Deshpande, Mitul Modi, Thomas J. De Bonis +6 more | 2022-01-11 |
| 11056466 | Package on package thermal transfer systems and methods | Omkar G. Karhade, Christopher L. Rumer, Nitin A. Deshpande | 2021-07-06 |
| 10607976 | Offset interposers for large-bottom packages and large-die package-on-package structures | Russell K. Mortensen, Nicholas R. Watts | 2020-03-31 |
| 10446530 | Offset interposers for large-bottom packages and large-die package-on-package structures | Russell K. Mortensen, Nicholas R. Watts | 2019-10-15 |
| 10438930 | Package on package thermal transfer systems and methods | Omkar G. Karhade, Christopher L. Rumer, Nitin A. Deshpande | 2019-10-08 |
| 10231338 | Methods of forming trenches in packages structures and structures formed thereby | Naga Sivakumar Yagnamurthy, Huiyang Fei, Pramod Malatkar, Prasanna Raghavan | 2019-03-12 |
| 10128225 | Interconnect structures with polymer core | Sandeep Razdan, Edward R. Prack, Sairam Agraharam, Robert L. Sankman, Shan Zhong | 2018-11-13 |
| 10121722 | Architecture material and process to improve thermal performance of the embedded die package | Chandra Mohan Jha, Eric J. Li, Zhaozhi Li | 2018-11-06 |
| 9691727 | Pad-less interconnect for electrical coreless substrate | Javier Soto Gonzalez, Charavana K. Gurumurthy, Debendra Mallik | 2017-06-27 |
| 9691728 | BBUL top side substrate layer enabling dual sided silicon interconnect and stacking flexibility | Min Tao, John S. Guzek | 2017-06-27 |
| 9666549 | Methods for solder for through-mold interconnect | Chia-Pin Chiu, Xiaorong Xiong, Linda Zhang, Charles A. Gealer | 2017-05-30 |
| 9613934 | Interconnect structures with polymer core | Sandeep Razdan, Edward R. Prack, Sairam Agraharam, Robert L. Sankman, Shan Zhong | 2017-04-04 |