| 12476174 |
Ultra-thin, hyper-density semiconductor packages |
Debendra Mallik, Robert L. Sankman, Mitul Modi, Sanka Ganesan, Rajasekaran Swaminathan +4 more |
2025-11-18 |
|
| 12417958 |
Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and PoP adhesive keep out zone |
Elizabeth Nofen, Shripad Gokhale, Nick Ross, Amram Eitan, Nisha Ananthakrishnan +4 more |
2025-09-16 |
|
| 12406906 |
Through mold interconnect drill feature |
Rees WINTERS, Purushotham Kaushik Muthur Srinath |
2025-09-02 |
|
| 12406914 |
Ultra-thin, hyper-density semiconductor packages |
Debendra Mallik, Robert L. Sankman, Mitul Modi, Sanka Ganesan, Rajasekaran Swaminathan +4 more |
2025-09-02 |
|
| 12394773 |
Laser ablation-based surface property modification and contamination removal |
Denis Myasishchev, Andrew V. Mazur, Purushotham Kaushik Muthur Srinath, Shripad Gokhale |
2025-08-19 |
|
| 12362340 |
Laser ablation-based surface property modification and contamination removal |
Denis Myasishchev, Andrew V. Mazur, Purushotham Kaushik Muthur Srinath, Shripad Gokhale |
2025-07-15 |
|
| 12347743 |
Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and pop adhesive keep out zone |
Elizabeth Nofen, Shripad Gokhale, Nick Ross, Amram Eitan, Nisha Ananthakrishnan +4 more |
2025-07-01 |
|
| 12315777 |
Microelectronics package comprising a package-on-package (POP) architecture with inkjet barrier material for controlling bondline thickness and POP adhesive keep out zone |
Elizabeth Nofen, Shripad Gokhale, Nick Ross, Amram Eitan, Nisha Ananthakrishnan +4 more |
2025-05-27 |
|
| 12107082 |
Offset interposers for large-bottom packages and large-die package-on-package structures |
Russell K. Mortensen, Nicholas R. Watts |
2024-10-01 |
$20,560,000 |
| 11978730 |
Offset interposers for large-bottom packages and large-die package-on-package structures |
Russell K. Mortensen, Nicholas R. Watts |
2024-05-07 |
$26,756,000 |
| 11798932 |
Offset interposers for large-bottom packages and large-die package-on-package structures |
Russell K. Mortensen, Nicholas R. Watts |
2023-10-24 |
$20,059,000 |
| 11705383 |
Through mold interconnect drill feature |
Rees WINTERS, Purushotham Kaushik Muthur Srinath |
2023-07-18 |
$21,060,000 |
| 11462527 |
Micro-trenching mold interface in a pop package |
Kumar Abhishek Singh, Zhaozhi Li, Thomas J. Debonis, Rees WINTERS |
2022-10-04 |
$13,460,000 |
| 11430724 |
Ultra-thin, hyper-density semiconductor packages |
Debendra Mallik, Robert L. Sankman, Mitul Modi, Sanka Ganesan, Rajasekaran Swaminathan +4 more |
2022-08-30 |
$13,077,000 |
| 11222877 |
Thermally coupled package-on-package semiconductor packages |
Omkar G. Karhade, Robert L. Sankman, Nitin A. Deshpande, Mitul Modi, Thomas J. De Bonis +6 more |
2022-01-11 |
$33,310,000 |
| 11056466 |
Package on package thermal transfer systems and methods |
Omkar G. Karhade, Christopher L. Rumer, Nitin A. Deshpande |
2021-07-06 |
$31,309,000 |
| 10607976 |
Offset interposers for large-bottom packages and large-die package-on-package structures |
Russell K. Mortensen, Nicholas R. Watts |
2020-03-31 |
$34,068,000 |
| 10446530 |
Offset interposers for large-bottom packages and large-die package-on-package structures |
Russell K. Mortensen, Nicholas R. Watts |
2019-10-15 |
$18,012,000 |
| 10438930 |
Package on package thermal transfer systems and methods |
Omkar G. Karhade, Christopher L. Rumer, Nitin A. Deshpande |
2019-10-08 |
$19,521,000 |
| 10231338 |
Methods of forming trenches in packages structures and structures formed thereby |
Naga Sivakumar Yagnamurthy, Huiyang Fei, Pramod Malatkar, Prasanna Raghavan |
2019-03-12 |
$21,255,000 |
| 10128225 |
Interconnect structures with polymer core |
Sandeep Razdan, Edward R. Prack, Sairam Agraharam, Robert L. Sankman, Shan Zhong |
2018-11-13 |
$26,640,000 |
| 10121722 |
Architecture material and process to improve thermal performance of the embedded die package |
Chandra Mohan Jha, Eric J. Li, Zhaozhi Li |
2018-11-06 |
$18,970,000 |
| 9691727 |
Pad-less interconnect for electrical coreless substrate |
Javier Soto Gonzalez, Charavana K. Gurumurthy, Debendra Mallik |
2017-06-27 |
$7,334,000 |
| 9691728 |
BBUL top side substrate layer enabling dual sided silicon interconnect and stacking flexibility |
Min Tao, John S. Guzek |
2017-06-27 |
$7,334,000 |
| 9666549 |
Methods for solder for through-mold interconnect |
Chia-Pin Chiu, Xiaorong Xiong, Linda Zhang, Charles A. Gealer |
2017-05-30 |
$12,187,000 |
