Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11217516 | Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing same | Sriram Muthukumar | 2022-01-04 |
| 10555417 | Mainboard assembly including a package overlying a die directly attached to the mainboard | Damion Searls, Weston Roth, Margaret D. Ramirez, James Jackson, Rainer Thomas | 2020-02-04 |
| 10251273 | Mainboard assembly including a package overlying a die directly attached to the mainboard | Damion Searls, Weston Roth, Margaret D. Ramirez, James Jackson, Rainer Thomas | 2019-04-02 |
| 10186480 | Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing same | Sriram Muthukumar | 2019-01-22 |
| 9842832 | High density interconnection of microelectronic devices | Omkar G. Karhade, John S. Guzek, Johanna M. Swan, Christopher J. Nelson, Nitin A. Deshpande +6 more | 2017-12-12 |
| 9820384 | Flexible electronic assembly method | Sasha N. Oster, Robert L. Sankman, Omkar G. Karhade, John S. Guzek, Ravi Mahajan +8 more | 2017-11-14 |
| 9666549 | Methods for solder for through-mold interconnect | Chia-Pin Chiu, Xiaorong Xiong, Linda Zhang, Robert M. Nickerson | 2017-05-30 |
| 9617148 | Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chips | Qing Ma, Johanna M. Swan, Min Tao, Edward Zarbock | 2017-04-11 |
| 9397071 | High density interconnection of microelectronic devices | Omkar G. Karhade, John S. Guzek, Johanna M. Swan, Christopher J. Nelson, Nitin A. Deshpande +6 more | 2016-07-19 |
| 9368429 | Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chips | Qing Ma, Johanna M. Swan, Min Tao, Edward A. Zarbock | 2016-06-14 |
| 9177831 | Die assembly on thin dielectric sheet | Chia-Pin Chiu, Qing Ma, Robert L. Sankman, Paul B. Fischer, Patrick Morrow +2 more | 2015-11-03 |
| 9159690 | Tall solders for through-mold interconnect | Chia-Pin Chiu, Xiaorong Xiong, Linda Zhang, Robert M. Nickerson | 2015-10-13 |
| 7166924 | Electronic packages with dice landed on wire bonds | Jicun Lu | 2007-01-23 |
| 6750551 | Direct BGA attachment without solder reflow | Kristopher Frutschy, Carlos Gonzalez | 2004-06-15 |
| 6239973 | EMI containment for microprocessor core mounted on a card using surface mounted clips | Scot W. Taylor, Robert Starkston, Michael Rutigliano, Raymond A. Krick, John A. Rabenius +3 more | 2001-05-29 |
| 6043560 | Thermal interface thickness control for a microprocessor | Kevin Haley, Niel C. Delaplane, Ravindranath V. Mahajan, Robert Starkston, Joseph C. Krauskopf | 2000-03-28 |
| 6043983 | EMI containment for microprocessor core mounted on a card using surface mounted clips | Scot W. Taylor, Robert Starkston, Michael Rutigliano, Raymond A. Krick, John A. Rabenius +3 more | 2000-03-28 |