| 11217516 |
Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing same |
Sriram Muthukumar |
2022-01-04 |
$22,100,000 |
| 10555417 |
Mainboard assembly including a package overlying a die directly attached to the mainboard |
Damion Searls, Weston Roth, Margaret D. Ramirez, James Jackson, Rainer Thomas |
2020-02-04 |
$21,361,000 |
| 10251273 |
Mainboard assembly including a package overlying a die directly attached to the mainboard |
Damion Searls, Weston Roth, Margaret D. Ramirez, James Jackson, Rainer Thomas |
2019-04-02 |
$26,887,000 |
| 10186480 |
Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing same |
Sriram Muthukumar |
2019-01-22 |
$27,645,000 |
| 9842832 |
High density interconnection of microelectronic devices |
Omkar G. Karhade, John S. Guzek, Johanna M. Swan, Christopher J. Nelson, Nitin A. Deshpande +6 more |
2017-12-12 |
$18,742,000 |
| 9820384 |
Flexible electronic assembly method |
Sasha N. Oster, Robert L. Sankman, Omkar G. Karhade, John S. Guzek, Ravi Mahajan +8 more |
2017-11-14 |
$11,178,000 |
| 9666549 |
Methods for solder for through-mold interconnect |
Chia-Pin Chiu, Xiaorong Xiong, Linda Zhang, Robert M. Nickerson |
2017-05-30 |
$12,187,000 |
| 9617148 |
Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chips |
Qing Ma, Johanna M. Swan, Min Tao, Edward Zarbock |
2017-04-11 |
$8,965,000 |
| 9397071 |
High density interconnection of microelectronic devices |
Omkar G. Karhade, John S. Guzek, Johanna M. Swan, Christopher J. Nelson, Nitin A. Deshpande +6 more |
2016-07-19 |
$7,217,000 |
| 9368429 |
Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chips |
Qing Ma, Johanna M. Swan, Min Tao, Edward A. Zarbock |
2016-06-14 |
$9,885,000 |
| 9177831 |
Die assembly on thin dielectric sheet |
Chia-Pin Chiu, Qing Ma, Robert L. Sankman, Paul B. Fischer, Patrick Morrow +2 more |
2015-11-03 |
$14,434,000 |
| 9159690 |
Tall solders for through-mold interconnect |
Chia-Pin Chiu, Xiaorong Xiong, Linda Zhang, Robert M. Nickerson |
2015-10-13 |
$14,687,000 |
| 7166924 |
Electronic packages with dice landed on wire bonds |
Jicun Lu |
2007-01-23 |
$17,655,000 |
| 6750551 |
Direct BGA attachment without solder reflow |
Kristopher Frutschy, Carlos Gonzalez |
2004-06-15 |
$34,603,000 |
| 6239973 |
EMI containment for microprocessor core mounted on a card using surface mounted clips |
Scot W. Taylor, Robert Starkston, Michael Rutigliano, Raymond A. Krick, John A. Rabenius +3 more |
2001-05-29 |
$200,835,000 |
| 6043560 |
Thermal interface thickness control for a microprocessor |
Kevin Haley, Niel C. Delaplane, Ravindranath V. Mahajan, Robert Starkston, Joseph C. Krauskopf |
2000-03-28 |
$241,499,000 |
| 6043983 |
EMI containment for microprocessor core mounted on a card using surface mounted clips |
Scot W. Taylor, Robert Starkston, Michael Rutigliano, Raymond A. Krick, John A. Rabenius +3 more |
2000-03-28 |
$241,499,000 |
