Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Methods for solder for through-mold interconnect

Methods for solder for through-mold interconnect

US Patent 9666549 · Granted May 30, 2017

Estimated economic value: $12,187,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Ultra-thin, hyper-density semiconductor packages2025
Microelectronics package comprising a package-on-package (PoP) architecture with2025
Through mold interconnect drill feature2025
Ultra-thin, hyper-density semiconductor packages2025
Laser ablation-based surface property modification and contamination removal2025
Heat dissipation structures for optical communication devices2025
Laser ablation-based surface property modification and contamination removal2025
Microelectronics package comprising a package-on-package (PoP) architecture with2025
High density substrate routing in package2025
Microelectronics package comprising a package-on-package (POP) architecture with2025
TEC-embedded dummy die to cool the bottom die edge hotspot2025
Boiling enhancement structures for immersion cooled electronic systems2025