Issued Patents All Time
Showing 25 most recent of 46 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10555417 | Mainboard assembly including a package overlying a die directly attached to the mainboard | Weston Roth, Margaret D. Ramirez, James Jackson, Rainer Thomas, Charles A. Gealer | 2020-02-04 |
| 10251273 | Mainboard assembly including a package overlying a die directly attached to the mainboard | Weston Roth, Margaret D. Ramirez, James Jackson, Rainer Thomas, Charles A. Gealer | 2019-04-02 |
| 9478488 | Reducing loadline impedance in a system | Edward P. Osburn | 2016-10-25 |
| 8659909 | Method for reducing loadline impedance in a system | Edward P. Osburn | 2014-02-25 |
| 7886809 | Apparatus and method for passive phase change thermal management | Terrance Dishongh, David Pullen | 2011-02-15 |
| 7791585 | Method of fabricating flexible display | James Jackson, Terrance Dishongh | 2010-09-07 |
| 7638884 | Thin semiconductor device package | James Jackson, Yoshihiro Tomita | 2009-12-29 |
| 7538440 | Method for improved high current component interconnections | Dudi Amir | 2009-05-26 |
| 7517732 | Thin semiconductor device package | James Jackson, Yoshihiro Tomita | 2009-04-14 |
| 7495318 | Apparatus and method for improving AC coupling on circuit boards | Weston Roth, James Jackson | 2009-02-24 |
| 7316265 | Method for passive phase change thermal management | Terrance Dishongh, David Pullen | 2008-01-08 |
| 7255492 | Electro-optic surface mount light pipe and connector | Weston Roth, Thomas Morgan, James Jackson | 2007-08-14 |
| 7230317 | Capacitor placement for integrated circuit packages | Tom E. Pearson, Terry Dishongh, David Amir | 2007-06-12 |
| 7158111 | Flexible display | James Jackson, Terrance Dishongh | 2007-01-02 |
| 7145782 | Reducing loadline impedance in a system | Edward P. Osburn | 2006-12-05 |
| 7135758 | Surface mount solder method and apparatus for decoupling capacitance and process of making | Weston Roth, James Jackson | 2006-11-14 |
| 7122891 | Ceramic embedded wireless antenna | Terrance Dishongh, Weston Roth, Tom E. Pearson | 2006-10-17 |
| 7057114 | Circuit board with added impedance | Terry Dishongh, Prateek Dujari, Bin Lian | 2006-06-06 |
| 6996899 | Electronic assembly and a method of constructing an electronic assembly | Terrance Dishongh, James Jackson | 2006-02-14 |
| 6913999 | Semiconductor device with components embedded in backside diamond layer | Prateek Dujari, Bin Lian | 2005-07-05 |
| 6906921 | Channeled heat dissipation device and a method of fabrication | Tom E. Pearson, James Jackson | 2005-06-14 |
| 6905979 | Apparatus and method for improving AC coupling on circuit boards | Weston Roth, James Jackson | 2005-06-14 |
| 6903271 | Electronic assembly with thermally separated support | Tom E. Pearson, Terry Dishongh | 2005-06-07 |
| 6884087 | Socket with multiple contact pad area socket contacts | Thomas Morgan, Weston Roth | 2005-04-26 |
| 6856016 | Method and apparatus using nanotubes for cooling and grounding die | Terrance Dishongh, James Jackson | 2005-02-15 |