| 7057114 |
Circuit board with added impedance |
Terry Dishongh, Bin Lian, Damion Searls |
2006-06-06 |
| 6913999 |
Semiconductor device with components embedded in backside diamond layer |
Damion Searls, Bin Lian |
2005-07-05 |
| 6877318 |
Electrical energy-generating heat sink system and method of using same to recharge an energy storage device |
Pooya Tadayon, Franklin Monzon |
2005-04-12 |
| 6797085 |
Metallurgically enhanced heat sink |
Terrance Dishongh, Bin Lian, Damion Searls |
2004-09-28 |
| 6774310 |
Surface mount connector lead |
Terrance Dishongh, Bin Lian, Damion Searls |
2004-08-10 |
| 6775122 |
Circuit board with added impedance |
Terry Dishongh, Bin Lian, Damion Searls |
2004-08-10 |
| 6752204 |
Iodine-containing thermal interface material |
Terrance Dishongh, Bin Lian, Damion Searls |
2004-06-22 |
| 6649937 |
Semiconductor device with components embedded in backside diamond layer |
Damion Searls, Bin Lian |
2003-11-18 |
| 6627978 |
Chip package enabling increased input/output density |
Franklin Monzon, Pooya Tadayon |
2003-09-30 |
| 6624643 |
Apparatus and method to read output information from a backside of a silicon device |
Terrence J. Dishongh, Bin Lian, Damion Searls |
2003-09-23 |
| 6574963 |
Electrical energy-generating heat sink system and method of using same to recharge an energy storage device |
Pooya Tadayon, Franklin Monzon |
2003-06-10 |
| 6550531 |
Vapor chamber active heat sink |
Damion Searls, Terrance Dishongh, Bin Lian |
2003-04-22 |
| 6521516 |
Process for local on-chip cooling of semiconductor devices using buried microchannels |
Franklin Monzon, Bin Lian |
2003-02-18 |
| 6486589 |
Circuit card assembly having controlled vibrational properties |
Terrance Dishongh, Bin Lian, Damion Searls |
2002-11-26 |
| 6359372 |
Circuit card assembly having controlled expansion properties |
Terrance Dishongh, Bin Lian, Damion Searls |
2002-03-19 |
| 6327145 |
Heat sink with integrated fluid circulation pump |
Bin Lian, Terrance Dishongh, Damion Searls |
2001-12-04 |