| 12506083 |
Liquid metal interconnect for modular package server architecture |
Karumbu Meyyappan, Jeffory L. Smalley, Gregorio R. Murtagian, Srikant Nekkanty, Eric J. M. Moret |
2025-12-23 |
|
| 12500137 |
Directly impinging pressure modulated spray cooling and methods of target temperature control |
Prabhakar Subrahmanyam, Tewodros Fiseha Wondimu, Ying-Feng PANG, Muhammad Waseem Ahmad, Paul Diglio +1 more |
2025-12-16 |
|
| 12494435 |
Liquid metal interconnect for modular system on an interposer server architecture |
Karumbu Meyyappan, Jeffory L. Smalley, Gregorio R. Murtagian, Srikant Nekkanty, Eric J. M. Moret +1 more |
2025-12-09 |
|
| 12436314 |
Technologies for chip-to-chip optical data transfer background |
Khaled Ahmed, Joshua B. Fryman, Sergey Shumarayev |
2025-10-07 |
|
| 12413001 |
Heterogenous socket contact for electrical and mechanical performance scaling in a microelectronic package |
Zhichao Zhang, Zhe Chen, Steven A. Klein, Feifei Cheng, Srikant Nekkanty +2 more |
2025-09-09 |
|
| 12411296 |
Reworkable zero-force insertion electrical optical package socket and method |
Eric J. M. Moret, Karumbu Meyyappan, Paul Diglio |
2025-09-09 |
|
| 12355002 |
Hyperchip |
Mark Bohr, Wilfred Gomes, Rajesh Kumar, Doug B. Ingerly |
2025-07-08 |
|
| 12345932 |
Die last and waveguide last architecture for silicon photonic packaging |
Bai Nie, Leonel Arana, Yonggang Li, Changhua Liu, Kristof Darmawikarta +4 more |
2025-07-01 |
|
| 12349303 |
Low force liquid metal interconnect solutions |
Karumbu Meyyappan, Kyle Arrington, David Craig |
2025-07-01 |
|
| 12341080 |
Semiconductor device stack-up with bulk substrate material to mitigate hot spots |
Shrenik Kothari, Chandra Mohan Jha, Weihua Tang, Robert L. Sankman, Xavier Francois Brun |
2025-06-24 |
|
| 12313890 |
Through-substrate optical vias |
Zhichao Zhang, Brandon C. Marin, Tarek A. Ibrahim, Kemal Aygun, Stephen Andrew Smith |
2025-05-27 |
|
| 12298572 |
Device, method and system for optical communication with a photonic integrated circuit chip and a transverse oriented lens structure |
Changhua Liu, Zhichao Zhang, Liang Zhang, Srikant Nekkanty |
2025-05-13 |
|
| 12272484 |
Coreless electronic substrates having embedded inductors |
Srinivas V. Pietambaram, Kristof Darmawikarta, Tarek A. Ibrahim, Prithwish Chatterjee |
2025-04-08 |
|
| 12230610 |
Double-sided substrate with cavities for direct die-to-die interconnect |
— |
2025-02-18 |
|
| 12213288 |
Self cooling adaptive flow branching heat exchanger system for cooling of one or more semiconductor chips |
Prabhakar Subrahmanyam, Arun Krishnamoorthy, Victor Polyanko, Ying-Feng PANG, Yi Xia +2 more |
2025-01-28 |
|
| 12164147 |
Device, method and system for optical communication with a waveguide structure and an integrated optical coupler of a photonic integrated circuit chip |
Changhua Liu, Zhichao Zhang, Liang Zhang |
2024-12-10 |
$13,394,000 |
| 12087658 |
Hybrid thermal interface material (TIM) with reduced 3D thermal resistance |
Joe Walczyk |
2024-09-10 |
$16,964,000 |
| 12074138 |
Hyperchip |
Mark Bohr, Wilfred Gomes, Rajesh Kumar, Doug B. Ingerly |
2024-08-27 |
$26,513,000 |
| 12057370 |
Vacuum modulated two phase cooling loop efficiency and parallelism enhancement |
Paul Diglio, David Shia |
2024-08-06 |
$17,070,000 |
| 12032002 |
Chevron interconnect for very fine pitch probing |
— |
2024-07-09 |
$24,938,000 |
| 12021016 |
Thermally enhanced silicon back end layers for improved thermal performance |
Chandra Mohan Jha, Aastha Uppal, Weihua Tang, Paul Diglio, Xavier Francois Brun |
2024-06-25 |
$22,163,000 |
| 11984430 |
Hyperchip |
Mark Bohr, Wilfred Gomes, Rajesh Kumar, Doug B. Ingerly |
2024-05-14 |
$33,809,000 |
| 11978689 |
Semiconductor device stack-up with bulk substrate material to mitigate hot spots |
Shrenik Kothari, Chandra Mohan Jha, Weihua Tang, Robert L. Sankman, Xavier Francois Brun |
2024-05-07 |
$26,756,000 |
| 11976671 |
Vacuum modulated two phase cooling loop performance enhancement |
Paul Diglio, David Shia |
2024-05-07 |
$26,756,000 |
| 11822249 |
Method and apparatus to develop lithographically defined high aspect ratio interconnects |
— |
2023-11-21 |
$28,968,000 |
