Issued Patents All Time
Showing 26–50 of 55 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11639556 | Massively-parallel micronozzle array for direct write electrodeposition of high-density microstructure arrays | Joe Walczyk, Andrew Hoitink, Tanner Schulz | 2023-05-02 |
| 11626395 | Thermal spreading management of 3D stacked integrated circuits | Robert L. Sankman, Weihua Tang, Chandra Mohan Jha, Zhimin Wan | 2023-04-11 |
| 11622466 | Low force liquid metal interconnect solutions | Karumbu Meyyappan, Kyle Arrington, David Craig | 2023-04-04 |
| 11581237 | Cooling apparatuses for microelectronic assemblies | Joe Walczyk | 2023-02-14 |
| 11543454 | Double-beam test probe | Paul Diglio, Karumbu Meyyappan | 2023-01-03 |
| 11515232 | Liquid cooling through conductive interconnect | Chia-Pin Chiu, Robert L. Sankman | 2022-11-29 |
| 11398414 | Sloped metal features for cooling hotspots in stacked-die packages | Zhimin Wan, Chia-Pin Chiu, Joe Walczyk, Chandra Mohan Jha, Weihua Tang +2 more | 2022-07-26 |
| 11372023 | Slip-plane MEMs probe for high-density and fine pitch interconnects | Joe Walczyk | 2022-06-28 |
| 11268983 | Chevron interconnect for very fine pitch probing | — | 2022-03-08 |
| 11262384 | Fine pitch probe card methods and systems | David Shia | 2022-03-01 |
| 11249113 | High density and fine pitch interconnect structures in an electric test apparatus | Mark Bohr, Joe Walczyk | 2022-02-15 |
| 11204555 | Method and apparatus to develop lithographically defined high aspect ratio interconnects | — | 2021-12-21 |
| 11189585 | Selective recess of interconnects for probing hybrid bond devices | Brennen Mueller, Adel A. Elsherbini, Mauro J. Kobrinsky, Johanna M. Swan, Shawna M. Liff | 2021-11-30 |
| 11127727 | Thermal spreading management of 3D stacked integrated circuits | Robert L. Sankman, Weihua Tang, Chandra Mohan Jha, Zhimin Wan | 2021-09-21 |
| 11061068 | Multi-member test probe structure | Justin Huttula | 2021-07-13 |
| 11024601 | Hyperchip | Mark Bohr, Wilfred Gomes, Rajesh Kumar, Doug B. Ingerly | 2021-06-01 |
| 10935573 | Slip-plane MEMS probe for high-density and fine pitch interconnects | Joe Walczyk | 2021-03-02 |
| 10877068 | High density and fine pitch interconnect structures in an electric test apparatus | Mark Bohr, Joe Walczyk | 2020-12-29 |
| 10866264 | Interconnect structure with varying modulus of elasticity | Justin Huttula | 2020-12-15 |
| 10677845 | Converged test platforms and processes for class and system testing of integrated circuits | Abram M. Detofsky, Evan M. Fledell, Mustapha Amadu Abdulai, John M. Peterson, Dinia P. Kitendaugh +2 more | 2020-06-09 |
| 10488438 | High density and fine pitch interconnect structures in an electric test apparatus | Mark Bohr, Joe Walczyk | 2019-11-26 |
| 10101381 | Space transformation methods | Erkan Acar, Armen Y. Balian, Ethan Caughey | 2018-10-16 |
| 9523713 | Interconnects including liquid metal | Youngseok Oh, Joe Walczyk, Jin-Bin Yang, Ting Zhong | 2016-12-20 |
| 9360502 | Increasing current carrying capability through direct liquid cooling of test contacts | Warren S. Crippen, Brett D. Grossman, Roy E. Swart | 2016-06-07 |
| 8937794 | Sort probe over current protection mechanism | Benjamin J. Norris, Mark W. Dryfuse | 2015-01-20 |